Osram Oled Gmbh

Ams-osram International Gmbh

Lars Nähle

Sven Gerhard

Christoph Eichler

Andreas Löffler

André Somers

John Brückner

Urs Heine

The invention relates to a radiation-emitting semiconductor chip, having: a semiconductor body comprising an active region which is designed to generate electromagnetic radiation; a resonator which comprises a first end region and a second end region; and at least one cut-out in the semiconductor body, said cut-out passing completely through the active region, wherein: the active region is situated in the resonator, and the cut-out defines a reflectivity for the electromagnetic radiation. The invention also relates to a radiation-emitting semiconductor component, a method for producing a radiation-emitting semiconductor chip, and a method for producing radiation-emitting semiconductor components.

Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chip

A method for singulating semiconductor components () is specified, said method comprising the steps of providing a carrier (), applying at least two semiconductor chips () on the carrier (), etching at least one break nucleus () at a side of the carrier () facing the semiconductor chips (), and singulating at least two semiconductor components () by breaking the carrier () along the at least one break nucleus (). The at least one break nucleus () extends at least in places in a vertical direction (z), the vertical direction (z) being perpendicular to a main extension plane of the carrier (), and the at least one break nucleus () is arranged between the two semiconductor chips () in a lateral direction (x), the lateral direction (x) being parallel to the main extension plane of the carrier (). Further, each of the semiconductor components () comprises at least one of the semiconductor chips (), and the expansion of the at least one break nucleus () in the vertical direction (z) is at least% of the expansion of the carrier () in the vertical direction (z). Furthermore, a semiconductor component () is specified.

Method for manufacturing optoelectric semiconductor component and optoelectric semiconductor component device

Growing community of inventors

Bad Abbach, Germany

Lars Nähle