Nanda Technologies Gmbh

Alis Corporation

Carl Zeiss Microscopy Gmbh

Imec

Lars Markwort

Billy W Ward

Raymond Hill

Randall G Percival

Louis S Farkas, Iii

Dirk Aderhold

John Anthony Notte, Iv

Klaus Edinger

Ulrich Mantz

Rajeshwar Chhibber

Klaus Eckerl

Norbert Harendt

Pierre-Yves Guittet

Christoph Kappel

Reza Kharrazian

Sandip Halder

John A Notte

Markus Estermann

Ernst Hegels

Anne Jourdain

A method of inspecting a bonded waferarrangement comprises:

Methods and systems for inspecting bonded wafers

Ion sources, systems and methods are disclosed.

Ion sources, systems and methods

A wafer inspection system comprises a camera having a field of view, an object mount configured to position at least a portion of surfaceof an objectat an object planerelative to the camera and within the field of view of the camera and at least one surface portioncarrying a multitude of retroreflectorsdisposed at a greater &#x394;d distance from the camera than the object plane and within the field of view of the camera.

Semiconductor wafer inspection system and method

A wafer inspection method comprises imaging a full surface of the wafer at an imaging resolution insufficient to resolve individual microstructures which are repetitively arranged on the wafer. A maskis applied to the recorded image and unmasked portionsof the image are further processed by averaging. The unmasked portionsare selected such that they include memory portions of the wafer.

Method of inspecting and processing semiconductor wafers

A method of manufacturing a plurality of semiconductor wafers comprising micro-inspecting at least one location within at least one micro-inspected pattern field and determining at least one parameter value representing a property of the wafer at the micro-inspected location, macro-inspecting a plurality of locations within the at least one micro-inspected pattern field and determining, for each macro-inspected location of the macro-inspected pattern field, at least one parameter value representing the property of the wafer at the macro-inspected location based on the light intensity recorded for the macro-inspected location and on the at least one parameter value representing the property of the wafer at the micro-inspected location of this pattern field.

Methods of inspecting and manufacturing semiconductor wafers

A method of inspecting a semiconductor substrate having a back surface and including at least one piece of metal embedded in the substrate comprises directing measuring light towards the back surface of the substrate and detecting a portion of the measuring light received back from the substrate. The method also includes determining a distance between the piece of metal and the back surface based upon the detected measuring light received back from the substrate.

Methods of processing and inspecting semiconductor substrates

An inspection system includes optics, an object support for mounting an object in a region of an object plane of the optics, a bright-field light source, and a dark-field light source. The inspection system also includes an image detector having a radiation sensitive substrate disposed in a region of an image plane of the optics and a beam dump.

Optical inspection system and method

An inspection system includes imaging optics for imaging an object plane into an image plane. The imaging optics include an objective lens having positive optical power, a first lens group having negative optical power, and a second lens group having positive optical power. The optical elements are arranged along a common unfolded optical axis with a pupil plane of the imaging optics located between the first lens group and the second lens group.

A wafer inspection system has a bright field imaging beam path and a dark field imaging beam path to obtain bright field images and dark field images of a full 300 mm wafer. The optical system provides for telecentric imaging and has low optical aberrations. The bright field and dark field beam paths are folded such that the system can be integrated to occupy a low volume with a small foot print.

Growing community of inventors

Haimhausen, Germany

Lars Markwort