Atotech Deutschland Gmbh

Lars Kohlmann

Heiko Brunner

Philip Hartmann

Klaus-Dieter Schulz

Olivier Mann

Agnieszka Witczak

Philipp Wachter

Mike Briese

Richard Richter

Dirk Rohde

Andreas Kirbs

Bernd Roelfs

Björn Dingwerth

Stefanie Ackermann

Lukas Bedrnik

Matthias Dammasch

Christian Ohde

Sengül Karasahin

Simon Pape

Timo Bangerter

Sven Rückbrod

Ellen Habig

Rangarajan Jagannathan

Sandra Lucks

James Adolf

Jun Wu

Angelo Ferro

Andre Schmökel

Sandra Niemann

Klaus Dieter Schulz

Jenny Schulz

The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.

Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions

The present invention concerns pyridinium compounds, a synthesis method for their preparation, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths. The plating baths are particularly suitable for use in filling of recessed structures in the electronics and semiconductor industry including dual damascene applications.

Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths

The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallization of display applications.

Plating bath compositions for electroless plating of metals and metal alloys

Disclosed is a chemical compound useful in a galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or bright nickel alloy coating characterized in that the chemical compound has general formula IA: in which in general formula IA, Rand R&#x2550;-CHCHor Rand Rtaken together with the N atom form a pyrrolidine ring or a morpholine ring.

3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths

The present invention is related to a galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy coating characterized in that the electroplating bath comprises at least one compound having the general formula (I) 

Galvanic nickel electroplating bath for depositing a semi-bright nickel

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper plating bath composition

A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings.

Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys

Additives for electrolyte baths for the electrodeposition of zinc or zinc alloy layer are described. The additives are polymers with terminal amino groups. These polymers are obtainable by reaction of at least one diamino compound (having two tertiary amino groups) with at least one di(pseudo)halogen compound, wherein the diamino compound is used in stoichiometric excess. The additives effect, in particular, a very little formation of bubbles and only few burnings as well as a uniform distribution of layer thickness in the electrodeposition of zinc or zinc alloy layers.

Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths

An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterized in that it further contains (ii) N-methyl pyrrolidone is described.

Pyrophosphate-based bath for plating of tin alloy layers

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Berlin, Germany

Lars Kohlmann