Seagate Technology Incorporated

Lars Halvar Ahlen

James Gary Wessel

Shanlin X Hao

Jason Bryce Gadbois

Bradley Jay Ver Meer

Kevin Anthony McNeill

Joseph Michael Stephan

Aaron Michael Collins

Edward Michael Erickson

Robert Aaron Newman

Lance Eugene Stover

Zoran Jandric

Dian Song

Ladislav Rudolf Pust

Neil Zuckerman

Edwin F Rejda

David Chris Seets

Feng Y Wang

William P Wood

Paul Julio Sonda

Tyler Lenn Perry

Ray V Rigles

Ning Shi

John C Heitke

Methods are described for forming a mounting surface on a slider body. In one method, an adhesion layer can be deposited on a top surface of a slider body. A first photolithography cycle deposits a first metal layer having a first thickness of at least 8 &#x3bc;m. A second photolithography cycle deposits a second metal layer having a second thickness of at least 8 &#x3bc;m over the first metal layer. The first and second layer form a mounting support on the top surface. In another method, the top surface is etched to form a mounting support.

Mounting supports that create a bond pad gap for a hard disk slider

A slider includes a slider body with an air-bearing surface and a top surface opposing the air-bearing surface. A plurality of slider bond pads are disposed on or parallel to the top surface and proximate to or at a trailing edge of the slider. The plurality of slider bond pads have an exposed surface facing away from the top surface of the slider body. One or more mounting supports extend from the top surface to a distance of at least 12 &#x3bc;m above the exposed surface of the plurality of slider bond pads.

A slider of a magnetic recording head comprises a media-facing surface, an upper surface opposing the media-facing surface, a leading edge, and a trailing edge. A plurality of electrical bond pads is disposed in a spaced-apart relationship on the trailing edge of the slider. An interconnect interposer is connected to the trailing edge of the slider. The interposer comprises a back side comprising a plurality of electrical contacts in contact with the plurality of bond pads on the trailing edge of the slider. The interposer also comprises a front side comprising a plurality of electrical interposer pads corresponding in number to the plurality of electrical contacts on the back side. The interposer further comprises a plurality of conductors each of which electrically couples one of the plurality of electrical contacts on the back side with one of the plurality of interposer pads on the front side.

Interconnect interposer attachable to a trailing edge of a slider

An apparatus comprises a slider of a magnetic recording head, a submount, and an interface defined between the slider and the submount. A laser diode is connected to the submount. A metal layer is provided at the interface between the slider and the submount. The metal layer connects at least about 30% of the surface area of the submount at the interface to the slider and serves as a thermal conduction pathway between the submount and the slider.

Laser diode submount/slider interface with reduced thermal resistance

A transducer having an external contact surface includes a writer and a contact member. The writer has a portion extendable relative to an adjacent portion of the external contact surface. The contact member surrounds at least a portion of the extendable writer portion and is spaced from the extendable writer portion. The coefficient of thermal expansion of the contact member is approximately equal to the coefficient of thermal expansion of the extendable writer portion.

Methods of manufacturing a transducer

This disclosure is directed to air-bearing sliders used in magnetic storage systems that employ a trench arranged between a transducing head connected to a slider body and a leading edge of the slider body. The trench is configured to divert air passing over an air-bearing surface of the slider body away from the transducing head.

Slider design for diverting airflow away from a transducer

An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold for bidirectional actuation. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.

Multipoint bending apparatus for lapping heads of a data storage device

An actuator adapted to adjust the profile of a carrier supporting a bar relative to a lapping surface. The carrier including a plurality of spaced control or actuation points along the length of the carrier for adjusting the profile of the mounting surface of the carrier adapted to support a bar for lapping. The actuator adapted to actuate the carrier at the spaced actuation points and including a plurality of actuation members movably actuated via pressure supplied to the actuation members. The actuation members are supported in spaced staggered relation in chambers in a manifold. The actuation members are spaced relative to the spaced actuation points and are supported relative to the manifold to provide precision actuation for incrementally adjusting the profile of the carrier.

A lapping system data acquisition unit is disclosed for use in measuring resistances of multiple resistors embedded in a structure to be machined. Each of multiple independent current sources directs a current through one of the multiple resistors embedded in the structure during machining of a surface of the structure. Each of multiple voltage sensing devices couples to a separate one of the multiple resistors and provides a separate analog voltage output signal indicative of the resistance of the resistor. Each of multiple filters is coupled to a separate one of the multiple voltage sensing devices Analog-to-digital conversion circuitry coupled to the multiple filters generates a digitized signal for each of the filtered output signals.

Growing community of inventors

Bloomington, MN, United States of America

Lars Halvar Ahlen