Telefonaktiebolaget Lm Ericsson (Publ)

Lars Erik Lundstrom

Paul Asger Eriksen

Hans-Christer Moll

Jan-Ake Engstrand

Ivan Jonas

Eva Ahlner

Dragutin Tretinjak

Gunther Bustrich

The present invention provides a method when using chips for tape automated bonding, or TAB structures, whereby a demand of having particular cutting and bending tools for each type of TAB structure as well as a particular thermod will no longer be necessary for the mounting of the TAB structures in a final circuit configuration. The terminal leads of a TAB structure are cut along the four sides by means of a particular cutting tool. Furthermore either the chip is glued to the substrate and/or the remaining portions of the cut terminal leads of the TAB structure are glued to the substrate, whereby if desirable intermediate shielding or dielectric layers simply may be arranged, whereupon all terminals are wire-bonded to the substrate according to prior art. TAB structures hereby may conveniently be used also for low levels of production without a raised investment cost for particular different tools for the respective chips.

Method for mounting a circuit

The present invention relates to a mold for simultaneously molding a plurality of ferrules onto a corresponding number of optical fibers. The mold preferably includes a runner plate, a first cavity plate, a second cavity plate, and a support plate, each of which is to be inserted between a movable top plate and a fixed bottom plate of a transfer molding machine. The plates to be inserted have a vertical inlet channel and primary and secondary runners for distributing molding compound. These runners lead to a plurality of first and second mutually coincidental mold cavities arranged in rows in the first and second cavity plates, respectively. In a preferred embodiment, each of the first and second mold cavities are made up of mutually coincidental, cylindrical coaxial parts and a larger coaxial, cylindrical bore formed in one or both cavity plates. The dividing plane between the first and second cavity plates coincides with the wider bore. The second mold cavity is formed in a conical insert which is inserted into the second cavity plate. The support plate includes narrow optical fiber receiving slots.

Mold and method for molding ferrules

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Saltsjo-Boo, Sweden

Lars Erik Lundstrom