Teradyne, Inc.

Larry W Akers

Brian S Merrow

Philip Luke Campbell

Joseph Francis Wrinn

Valquirio Nazare Carvalho

David Graziose

Shant Orchanian

Michael O McKenna

Nathan Blosser

An example test system includes test sites for testing devices under test (DUTs), where the test sites include a test site configured to hold a DUT for testing. The test system includes a thermal control system to control a temperature of the DUT separately from control over temperatures of other DUTs in other test sites. The thermal control system includes a thermoelectric cooler (TEC) and a structure that is thermally conductive. The TEC is in thermal communication with the DUT to control the temperature of the DUT by transferring heat between the DUT and the structure.

Thermal control system for an automated test system

An example test system includes a carrier having a test socket to receive a device to test. The test socket includes electrical connections. The test system also includes a lid assembly having a socket cap to contact the device to apply pressure to cause the device to connect electrically to the electrical connections. The socket cap includes a material having a thermal conductivity that exceeds a defined value. The lid assembly also includes one or more structures configured to provide surface area over which heat from the device dissipates. The one or more structures are made of a material having a thermal conductivity that exceeds the defined value.

System for testing devices inside of carriers

An example test system includes: a test slot to hold a device under test (DUT); a temperature control system comprising a phase-change material, with the temperature control system for maintaining a temperature of the phase-change material in a steady-state condition, with the phase-change material changing phase during a transient condition to affect a temperature of a thermally-conductive structure, and with the steady-state condition being longer in duration than the transient condition; and an air mover to direct air over the thermally-conductive structure and towards the DUT in the test slot in order to affect a temperature of the DUT.

Thermal control using phase-change material

An apparatus for controlling the temperature of an object, comprises: a housing comprising: a cavity adapted to accept an object, an air inlet configured to allow air to flow into the cavity, and an air outlet configured to allow air to flow out of the cavity; and a nest configured to hold the object within the housing such that the smallest planar dimension of the object is substantially aligned with the smallest planar dimension of the cavity; wherein the nest and housing are adapted to direct air flow from the air inlet, substantially in parallel across at least one surface of the object and in the direction of the smaller dimension of the at least one surface, to the air outlet.

Controlling the temperature of an object

A test slot assembly is provided for testing a storage device. The test slot assembly is configured to receive and support a storage device, or a storage device supported by a storage device transporter. The test slot assembly also includes a temperature sensing assembly. The temperature sensing assembly is arranged to measure a temperature of a storage device by way of physical contact. The test slot assembly also includes a clamping mechanism operatively associated with the housing. The clamping mechanism is operable to move the temperature sensing assembly into contact with a storage device.

Storage device temperature sensing

A test slot assembly is provided for testing a storage device. The test slot assembly is configured to receive and support a storage device, or a storage device supported by a storage device transporter. The test slot assembly also includes a conductive heating assembly. The conductive heating assembly is arranged to heat a storage device by way of thermal conduction.

Storage device testing system with a conductive heating assembly

A storage device transporter is provided for transporting a storage device and for mounting a storage device within a test slot. The storage device transporter includes a frame that is configured to receive and support a storage device. The storage device transporter also includes a conductive heating assembly that is associated with the frame. The conductive heating assembly is arranged to heat a storage device supported by the frame by way of thermal conduction.

Heating storage devices in a testing system

A storage device transporter is provided for transporting a storage device and for mounting a storage device within a test slot. The storage device transporter includes a frame that is configured to receive and support a storage device, and a clamping mechanism associated with the frame. The clamping mechanism is operable to apply a clamping force to a storage device supported by the frame The storage device transporter also includes a temperature sensor (e.g., a thermocouple). The clamping mechanism is operable to move the temperature sensor into contact with a storage device supported by the frame for measuring a temperature of the storage device.

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Westford, MA, United States of America

Larry W Akers