Impinj, Inc.

Larry Morrell

Andrew Edward Horch

Yanjun Ma

Ronald Lee Koepp

Ronald E Paulsen

Methods are provided, and devices made by such methods. One of the methods includes procuring a semiconductor wafer, processing the wafer to form a plurality of circuits on a top side, forming trenches on the top side between the adjacent circuits, forming a trench passivation layer on side walls of the trenches, forming conductive bumps on the top side of the wafer; and removing material from the bottom side to thin the wafer, and eventually separate the wafer along the trenches into dies, where each die includes only one of the circuits.

Growing community of inventors

Kirkland, WA, United States of America

Larry Morrell