Memc Electronic Materials, Inc.

Sunedison Semiconductor Limited

Larry Flannery

Ezio Bovio

Emanuele Corsi

Mark G Stinson

Dennis Buese

Madhavan S Esayanur

Antonio Maria Rinaldi

Alexis Grabbe

Methods for producing silicon on insulator structures with a reduced metal content in the device layer thereof are disclosed. Silicon on insulator structures with a reduced metal content are also disclosed.

Methods for reducing the metal content in the device layer of SOI structures and SOI structures produced by such methods

A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.

Dressing a wafer polishing pad

A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.

System and method for dressing a wafer polishing pad

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Warrenton, MO, United States of America

Larry Flannery