Raytheon Company

Larry E Cobb

Adam M Kennedy

Timothy S Romano

Steven M McCabe

A structure (20) is formed of a first article (22) such as a cold finger (82), a second article (24) such as an electronic component (78) to be affixed to and cooled by the cold finger (82), and a bonding element (26) disposed between and bonding together the first article (22) and the second article (24). The bonding element (26) includes a porous metallic body (28), such as a screen, a mesh, a felt, or a foam, and a mass of resin adhesive (36) impregnated into the metallic body (28). The mass of adhesive (36) contacts and bonds to the first article (22) and to the second article (24), and the porous metallic body (28) forms a substantially continuous, high-conductivity path between the first article (22) and the second article (24).

Bonded structure with high-conductivity bonding element

A getter assembly (38) includes a porous getter element (40) having an outer periphery (44), and a porous, thermally conductive, annular getter support (42) overlying the getter element (40) and contacting the outer surface (44) of the getter element (40). The getter assembly (38) further includes a wall (24) sized so that the annular getter support (42) is received within the wall (24) with a friction fit between an outer periphery (50) of the annular getter support (42) and an inner periphery of the wall (24). The getter support (42) supports the getter element (40) from the wall (24) and provides a thermally conductive pathway from the wall (24) to the getter element (40). The annular getter support (42) is typically a screen, a mesh, a felt, or a foam, which is deformable to conform to the inner wall (24) and to slide into the wall (24) with a friction fit that ensures good thermal contact.

Growing community of inventors

Goleta, CA, United States of America

Larry E Cobb