Laird Technologies Gmbh

Other

Larry Don Creasy, Jr

Yishen Lin

Min-Wei Hsu

Yi-Shen Lin

Kelly Cook

Richard Tsai

Dusan Lee

Weifan Wang

Alex Hsu

According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a roll of material includes a substrate. An insulating ink is on the substrate. A catalyst coating is on the substrate whereat the insulating ink is not present. The catalyst coating may be configured to provide the substrate with one or more catalytic surfaces suitable for electroless deposition of metal. Accordingly, metal plating may be electrolessly deposited on the catalyst coating without over-plating the insulating ink.

Selectively plated rolls of materials and related methods

Disclosed are exemplary embodiments of a flame retardant, electrically conductive adhesive material. In an exemplary embodiment, a flame retardant, electrically conductive adhesive material suitable for use as tape generally includes a layer of adhesive. A layer of electrically conductive fabric is on the layer of adhesive. A flame retardant coating is on the layer of electrically conductive fabric. The flame retardant coating includes a carbon-containing resin.

Flame retardant, electrically conductive adhesive materials and related methods

A metallized film-over-foam contact suitable for circuit grounding of surface mount technology devices generally includes a silicone foam resilient core member, a solderable electrically conductive layer, and an adhesive bonding the solderable electrically conductive layer to the resilient core member. The adhesive has no more than a maximum of 900 parts per million chlorine, no more than a maximum of 900 parts per million bromine, and no more than a maximum of 1,500 parts per million total halogens.

Metallized film-over-foam contacts

Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.

EMI shielding heat shrinkable tapes

An electromagnetic interference shield generally includes a resilient core member and an electrically conductive layer. An adhesive bonds the electrically conductive layer to the resilient core member. The adhesive can include halogen-free flame retardant. The electrically conductive layer can be provided with halogen-free flame retardant and/or a corrosion inhibitor.

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St. Clair, MO, United States of America

Larry Don Creasy, Jr