Sun Microsystems, Inc.

Other

Larry D Smith

Raymond E Anderson

Tanmoy Roy

Michael C Freda

Istvan Novak

Ali Hassanzadeh

Sungjun Chun

David Hockanson

Douglas W Forehand

Thomas J Pelc

Norman E Abt

William P Carter

Larry P Sammons

A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide power to the integrated circuit. The power laminate may also include a voltage regulator circuit, and a plurality of decoupling capacitors.

Power distribution system with a dedicated power structure and a high performance voltage regulator

A system and method for determining the desired decoupling components for a power distribution system having a voltage regulator module. The system may employ a mathematical model of a voltage regulator circuit, such as a switching voltage regulator. The mathematical model may be a SPICE model, or a circuit model in another format. The method may include simulating the operation of the power distribution system to obtain a estimate of the bulk capacitance required for effective decoupling. For digital systems, the method may include a cycle-by-cycle simulation of the power distribution system, wherein the simulation occurs over a number of clock cycles. The performance of the power distribution system may then be analyzed for each simulated clock cycle. The simulation may also include analyzing the transient responses and loop stability of the power distribution. Based on the results of these various simulations, the bulk capacitance value may be refined, thus allowing the system to begin the selection of specific decoupling components from the database in order to satisfy the bulk capacitance requirements.

System and method for determining the desired decoupling components for a power distribution system having a voltage regulator module

A system and method for determining the required decoupling capacitors for a power distribution system using an improved capacitor model. In one embodiment, a method for determining the decoupling capacitors for a power distribution system includes creating a model of the power distribution system using circuit simulation software, such as SPICE. The power distribution system model includes a plurality of cells interconnected at predetermined nodes. The method then selects one or more decoupling capacitors for the power distribution system. The decoupling capacitors are represented in the power distribution system model by a capacitor model, which is a mathematical model of an electrical circuit. The electrical circuit upon which the capacitor model is based is a ladder circuit. Following the selecting of the decoupling capacitors, the power distribution system model is update based on the selections, and operation of the power distribution system is then simulated. During the simulation, transfer impedance values are determined for each of the nodes, and compared to target impedance. The method is then repeated until each of the transfer impedance values is at or below the target impedance.

System and method for determining the required decoupling capacitors for a power distribution system using an improved capacitor model

A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide power to the integrated circuit. The PCB may include a signal layer for conveying signals to and from the integrated circuit, but does not include any means for providing core power to the integrated circuit. Thus, all core power provided to the integrated circuit may be supplied by the power laminate.

Method and apparatus for distributing power to integrated circuits

A methodology for determining the placement of decoupling capacitors in a power distribution system and system therefor is disclosed. In one embodiment, a method for determining the placement of decoupling capacitors in a power distribution system includes determining target impedance, creating a power distribution system model, performing an LC (inductive-capacitive) resonance analysis, and performing a cavity resonance analysis. During the performance of the LC resonance analysis, capacitors may be selected in order to suppress impedance peaks resulting from LC resonances. Following the LC resonance analysis, the method may place the capacitors in the power distribution system at evenly spaced intervals. During the performance of the cavity resonance analysis, the capacitors may be repositioned in the power distribution system so as to suppress cavity resonances.

Methodology for determining the placement of decoupling capacitors in a power distribution system

A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide core power to the integrated circuit. The power laminate may also include a voltage regulator circuit, and a plurality of decoupling capacitors. In one embodiment, the power laminate may include a plurality of apertures which allow for the passing of connections between the integrated circuit and the PCB. The integrated circuit may be mounted to the PCB by solder balls of a ball-grid array, elestomeric connections of a land-grid array, or other type of mounting. The each of the solder balls or elastomeric connections may pass though one of the apertures of the power laminate.

Power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages

A system and method for determining the desired decoupling capacitors for power distribution systems having frequency dependent target impedance. In one embodiment, the target impedance may be a function of frequency, and thus may vary in value over a frequency range from 0 Hz to a corner frequency. A specific quantity of decoupling capacitors may be selected to provide decoupling for the power distribution for a given frequency within the frequency range. A total impedance provided by the specific quantity of selected decoupling capacitors may be calculated and compared to the calculated target impedance for the given frequency. If the total impedance provided by the specific quantity of selected decoupling capacitors is greater than the target impedance for the given frequency, the impedance may be adjusted by changing the quantity of capacitors. Capacitors may continue to be added until the total impedance is less than the target impedance. This may be performed for one or more frequencies within the calculated frequency range.

System and method for determining the decoupling capacitors for power distribution systems with a frequency-dependent target impedance

A system and method for analyzing simultaneous switching noise. In one embodiment, a model may be provided for the electronic circuit to be analyzed. The electronic circuit may be an integrated circuit, a multi-chip module, a printed circuit assembly, or other type, and may in some embodiments include combinations of these types. The electronic circuit may include a plurality of drivers, each of which may be coupled to a power plane, a ground plane, and a transmission line. The connection of the driver may be accurately modeled in this manner. Each driver may be configured to switch between a logic high voltage and a logic low voltage. The modeled electronic circuit may also include a voltage source coupled to the power plane and the ground plane, a voltage regulator module, and a plurality of decoupling capacitors. The simultaneous switching of a plurality of drivers, from a logic high to a logic low, or vice versa, may be simulated. The system and method may then allow for the calculation of solutions for the transmission line and the power planes (as will be detailed below). The transmission line solution and power plane solution may be superimposed on each other, which may allow for an analysis of plane bounce, which may include one or more fluctuations in the voltage between the power plane and the ground planes.

System and method for analyzing simultaneous switching noise

A method for determining the desired decoupling components for stabilizing the electrical impedance in the power distribution system of an electrical interconnecting apparatus, including a method for measuring the ESR for an electrical device, a method for determining a number of desired decoupling components for a power distribution system, and a method for placing the desired decoupling components in the power distribution system. The method creates a model of the power distribution system based upon an M&times;N grid for both the power plane and the ground plane. The model receives input from a user and from a database of various characteristics for a plurality of decoupling components. The method determines a target impedance over a desired frequency range. The method selects decoupling components. The method determines a number for each of the decoupling components chosen. The method places current sources in the model at spatial locations corresponding to physical locations of active components. The method optionally also places a power supply in the model. The method selects specific locations in the model to calculate transfer impedance values as a function of frequency. The method effectuates the model to determine the transfer impedance values as the function of frequency at the specific locations previously chosen. The method then compares the transfer impedance values as the function of frequency at the specific locations to the target impedance for the power distribution system. The method determines a bill of goods for the power distribution system based upon the results of effectuating the model.

Method for determining the desired decoupling components for power distribution systems

A system and method for using a computer system to determine the desired decoupling components for stabilizing the electrical impedance in the power distribution system of an electrical interconnecting apparatus, including a method for measuring the ESR for an electrical device, a method for determining a number of desired decoupling components for a power distribution system, and a method for placing the desired decoupling components in the power distribution system. The method creates a model of the power distribution system based upon an M&times;N grid for both the power plane and the ground plane. The model receives input from a user and from a database of various characteristics for a plurality of decoupling components. The method determines a target impedance over a desired frequency range. The method selects decoupling components. The method determines a number for each of the decoupling components chosen. The method places current sources in the model at spatial locations corresponding to physical locations of active components. The method optionally also places a power supply in the model. The method selects specific locations in the model to calculate transfer impedance values as a function of frequency. The method effectuates the model to determine the transfer impedance values as the function of frequency at the specific locations previously chosen. The method then compares the transfer impedance values as the function of frequency at the specific locations to the target impedance for the power distribution system.

System and method for determining the desired decoupling components for power distribution systems using a computer system

A system and method for measuring the equivalent series resistance (ESR) of one or more capacitors using an impedance analyzer, whereby the capacitors are joined to the impedance analyzer with a conductive adhesive. The conductive adhesive may advantageously provide for an electrically and mechanically stable connection between the capacitor and the remainder of the electrical circuit used to measure the ESR of the capacitor. The conductive adhesive may include heat activated or cold solder, or conductive putty. The system comprises a measuring unit for sweeping a frequency range to find the minimum impedance for the capacitor and a connector assembly for holding the capacitor in an electrically and mechanically stable connection using the conductive adhesive. The connector assembly includes a mating portion adapted for electrically connecting the connector assembly to an I/O port of the measuring unit and a terminal portion that accommodates a connection to the capacitor using the conductive adhesive. The method comprises connecting a mating portion of the connector assembly to the impedance analyzer. Next, the impedance analyzer is calibrated, and the capacitor is then connected to a terminal portion of the connector assembly using the conductive adhesive. Finally, the impedance analyzer sweeps a frequency range to find the ESR for the capacitor. The method may also measure the ESR of each of a number of capacitors using an impedance analyzer. The method may connect in series the number of capacitors to the connector assembly using the conductive adhesive. The method determines the equivalent series resistance of each of the number of capacitors by dividing the minimum impedance by the number of capacitors. The method may also comprise selecting one or more capacitors, measuring the ESR of each of the capacitors, and determining a desired number of each of the capacitors for placing into a power distribution system.

Method and system for measuring equivalent series resistance of capacitors and method for decoupling power distribution systems

An ASIC includes a PLL and digital circuitry to quantize and measure phase and average maximum jitter between a system clock input to the PLL, and a PLL-generated clock signal. The system clock is input to a series-string of delay elements, each contributing a delay of about 1.DELTA.t. Each delay element is associated with a two-input logic element, such as an EX-OR gate or an EX-NOR gate. One input to each two-input logic element is a version of the PLL-generated clock delayed by about (N/2) .DELTA.t. The second input to the first EX-OR is the output from the first delay element, the second input to the first EX-NOR is the output from the second delay element, and so on. Whichever delay element outputs a signal most closely in phase with the delayed PLL-generated clock will have an associated two-input logic element signal with a minimum duty cycle. Each two-input logic element output signal is capacitor integrated, sampled, stored and digitized. The digitized output signal identifies the lowest duty cycle two-input logic element, and thus phase shift. The relative breadth of the integrated capacitor voltage profile provides a measure of average maximum jitter.

On-chip PLL phase and jitter self-test circuit

A replaceable part pallet designed to be assembled from two moldable shapes, one being a beam and the other being a slat with projections to extend through holes contained in the beams so that a single rod may be installed longitudinally through each beam and through projections on the slats to hold slats firmly fastened to three or more beams to form the pallet.

Interchangeable part plastic pallet

A locking mechanism has a threaded housing mounted in one member of a jack/vehicle assembly. The housing has a locking pin which threadably moves through the housing and extends into a socket in the other member off center from the jack swivel point thus locking the jack in position and providing support for the trailer. The locking pin has a taper at its extension end which provides positive locking pin engagement with the socket and compensates for wear. Extension and retraction of the locking pin is performed by screwing the pin into or out of the housing. The locking pin is retained in the housing through the use of retaining pins thus obstructing disassembly of the locking mechanism and possible loss of the locking pin in the field.

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San Jose, CA, United States of America

Larry D Smith