Western Digital Corporation

Larry D Rossean

William H Ambrosius, Iii

Randall M Chung

An improved chip topography for a disk memory controller circuit is provided which includes chip buffer circuitry disposed around the periphery of the chip wherein the chip buffer circuitry forms a quadrilateral outer framework on the chip and data I/O buffer circuitry forms a first side of the quadrilateral outer framework; data I/O buffer control circuitry disposed between first and second corners of the chip buffer circuitry and adjacent to the data I/O buffer circuitry; a microcontroller for regulating the functions of the disk memory controller chip wherein a first portion of the microcontroller is disposed adjacent to the data I/O buffer control circuitry and along a part of a second side of the chip buffer circuitry; drive control and unit select registers coupled to the microcontroller and the chip buffer circuitry, and disposed adjacent to the first portion of the microcontroller and along part of a third side and within a third corner of the chip buffer circuitry, said microcontroller further comprising a second portion disposed adjacent to the first portion of the microcontroller and within a third corner and along a part of the third side of the chip buffer circuitry; a read-only-memory (ROM) disposed adjacent to the second portion of the microcontroller along a part of a fourth side of the chip buffer circuitry, said microcontroller further comprising a third portion which is disposed adjacent to the ROM and along a part of the fourth side of the chip buffer circuitry; disk synchronization circuitry disposed adjacent to the third portion of the microcontroller and along a part of the fourth side of the chip buffer circuitry; shift registers disposed adjacent to the disk synchonization circuitry and the third portion of the microcontroller; error checking circuitry disposed adjacent to and between the first and third portions of the microcontroller and also disposed adjacent to the data I/O buffer control circuitry; and a register file disposed adjacent to and between the first and third portions of the microcontroller and also disposed adjacent to the error checking circuitry.

Chip topography for a MOS disk memory controller circuit

An improved chip topography for a disk memory controller circuit is provided which includes electrical interface circuitry disposed around the periphery of the chip and forming an approximately quadrilateral framework surrounding the remainder of the circuitry, a read-only-memory (ROM) disposed in one corner of the interface framework; a microcontroller disposed adjacent to the ROM and along part of a first side of the interface framework; read data processing circuitry disposed adjacent to the microcontroller and within a second corner of the interface framework and along part of a second side thereof; error checking circuitry disposed adjacent to the read data processing circuitry and along part of the second side of the interface framework; the microcontroller also being disposed adjacent to the error checking circuitry and along part of the second side of the interface framework; write data processing circuitry disposed adjacent to the microcontroller along the second side of the interface boundary, within a third corner of the interface framework and along a part of a third side of the interface boundary; the microcontroller also being disposed adjacent to the write data processing circuitry and along the third side of the interface framework; input/output (I/O) buffer/latch circuitry disposed adjacent to the micro controller along the third side of the interface framework, which is also disposed within the fourth corner and along a part of a fourth side of the interface framework, the microcontroller also being disposed adjacent to and between the I/O buffer/latch circuitry and the ROM along the fourth side of the interface framework; and task registers disposed between the microcontroller and the I/O buffer/latch circuitry.

An optimum chip topography for a MOS LSI Data Encryption Standard (DES) circuit, including interface and input/output circuitry disposed around the periphery of the chip, control circuitry disposed in a substantially rectangular area across the upper one-third of the surface of the chip, and, disposed on approximately the lower two-thirds of the surface of the chip and perpendicular to the control circuitry area, and arranged from one side of the chip to the other side of the chip, a key register, permuted choice circuitry, a first combinatorial circuit, a right data register, a second combinatorial circuit, a left data register, a P-combinatorial circuit, a first programmable logic arry group, and a second programmable logic array group. The bonding pad sequence for the MOS DES circuit chip is selected to allow the chip to be placed in either a 40-pin dual-in-line package or a 28-pin dual-in-line package. The bonding pad sequence for the MOS DES circuit chip is also selected to allow optimum arrangement of packages containing the DES circuit chips on a printed circuit board. Repetitive circuit cells and custom drawn circuit cells are both utilized so as to optimize use of semiconductor chip area.

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Westminster, CA, United States of America

Larry D Rossean