Alliedsignal Inc.

Uop Lcc

Universal Oil Products Company

Isola USA Corp.

Isola Laminate Systems Corporation

Larry D Olson

Jeffrey Robert Kamla

Richard George Sarazin

Henry R Johnson

Tarun Amla

Peggy Conn

Marc D Hein

Mary Jo Theyerl

John R Wold

Maureen D Burkhardt

Dave F Miller

Eugene P Pallardy, Jr

Guroen He

Edward Hammes

Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well as a monomer, flame retardant and initiator as well as prepregs and laminates made using the synthesized base resin and compounded varnishes.

Synthesized resins and varnishes and prepegs and laminates made therefrom

A method for manufacturing a cured resin impregnated substrate comprising placing a substrate into a impregnation zone including a solvent containing curable resin to produce a resin impregnated substrate and at least partially curing the resin impregnated substrate to produce a cured resin impregnated substrate, wherein the number of voids in the cured resin impregnated substrate are reduced by processing the substrate in at least one processing step that reduces the number of voids in the cured resin impregnated substrate product.

Methods of manufacturing voidless resin impregnated webs

A curable epoxide composition consists essentially of curable epoxides, dicyandiamide as a curing agent in an amount less than needed to fully cure the epoxides, an imidazole in an amount exceeding that needed as a catalyst and capable of curing the epoxides in combination with the dicyandiamide, a reactivity controller for the imidazole to reduce the curing speed, and a solvent. The use of undesirable solvents such as DMF is reduced. A glass transition temperature greater than 135.degree. C. is obtained in the cured composition and is maximized by balancing the amounts of dicyandiamide, the imidazole, and the reactivity controller.

Curing epoxy resins using dicy, imidazole and acid

Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate first with a solution of a catalytic metal and then with an electroless copper plating solution.

Electroless plating of substrates

A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a reactive brominated aromatic compound, particularly a member of the group consisting of group consisting of tribromophenyl maleimide, tribromostyrene, and pentabromobenzyl acrylate; and

Polyimide resin laminates

Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate with an electroless copper plating solution.

A laminate which has improved dimensional stability may be prepared by impregnating a reinforcing substrate such as a woven glass cloth with an epoxy resin system having a relatively high molecular weight, in excess of about 850, in the presence of a curing agent followed by curing, pressing and post-baking substrate to form the desired laminate board. The variation in this dimensional stability can also be improved by utilizing a B-stage substrate which has been cured to a lower flow percentage.

Laminate board possessing improved dimensional stability

A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol). Flame retardance is improved by the addition of octabromodiphenyl oxide.

A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol).

Polyimide resin from bis-imide, polyphenol and dicyandiamide

Multilayer laminates and substrates for carriers of silicon chips which are used in circuitry boards will comprise woven hybrid glass cloth formed from fiberglass and a second material which possesses a coefficient of thermal expansion of less than about 5.0.times.10.sup.-6 in/in/.degree.C. The resulting laminates will be thermally and dimensionally stable. As an example, a hybrid glass cloth may be formed in which the warp yarn of said cloth is fiberglass and the fill yarn is boron nitride. The resulting cloth may be used to form laminates which possess a coefficient of thermal expansion similar in nature to that of a chip carrier such as ceramic, thus minimizing the danger of a solder fracture.

Chip carrier substrates of hybrid woven glass cloths

Woven hybrid glass cloths which may be utilized as chip carrier substrates and as inner layers in multi-layer laminate circuit boards which will be stable due to a desired co-efficient of thermal expansion may be prepared by weaving fiberglass with a second material which possesses a co-efficient of thermal expansion of less than 5.0.times.10.sup.-6 inch/inch/.degree.C. The mixture of fiberglass in this material may be used as a warp and a fill yarn. The thus woven cloth will possess a dimensional stability suitable for use in preparing multi-layer materials and for use in direct mounting ceramic chip carriers to this chip carrier substrate. Examples of materials which possess a co-efficient of thermal expansion of less than the desired number will include nylon filaments, ceramics, boron nitrite filaments, etc.

Hybrid woven glass cloths

Flat plate absorber member includes a flat heat absorbing sheet of a thin metal foil such as copper, or a thin plastic film such as polyvinyl fluoride, bonded to a channeled substrate, and particularly to a plastic laminate such as a glass epoxy laminate. The improved absorber member provides an energy collecting efficiency which is much greater than that of a much more expensive conventional collector having a series of copper tubes soldered to a copper sheet. The absorber is preferably made by the method of taking a base sheet of fully cured glass epoxy laminate and overlaying it with a precut, patterned intermediate layer of semi-cured glass expoxy which defines the depth of the side walls of the channels. The cover sheet of metal foil or plastic film is then placed over the semi-cured glass epoxy intermediate layer and heat and pressure are applied to bond the semi-cured glass epoxy to the cover sheet and to the previously cured base sheet.

Laminated absorber member for flat plate solar collector and method of

Flat plate absorber member includes a flat heat absorbing sheet of a thin metal foil such as copper, or a thin plastic film such as polyvinyl fluoride, bonded to a channeled substrate, and particularly to a plastic laminate such as a glass epoxy laminate. The improved absorber member provides an energy collecting efficiency which is much greater than that of a much more expensive conventional collector having a series of copper tubes soldered to a copper sheet. The absorber is preferably made by the method of taking a base sheet of fully cured glass epoxy laminate and overlying it with a precut, patterned intermediate layer of semi-cured glass epoxy which defines the depth of the side walls of the channels. The cover sheet of metal foil or plastic film is then placed over the semi-cured glass epoxy intermediate layer and heat and pressure are applied to bond the semi-cured glass epoxy to the cover sheet and to the previously cured base sheet.

Growing community of inventors

Viroqua, WI, United States of America

Larry D Olson