Texas Instruments Corporation

Larry D Giaudrone

Peter J Sakakini

Randy V Tekavec

Royce E Naud

A method for bonding includes positioning a bonding strip adjacent a sole first bond head, the bonding strip having a plurality of strip units, and bonding, with only the first bond head, a first number of the plurality of strip units. The method further includes transporting the bonding strip from the first bond head and positioning the bonding strip adjacent a sole second bond head, and bonding, with only the second bond head, a remaining number of the plurality of strip units on the bonding strip. In one embodiment, the method also includes heating at least one of the plurality of strip units prior to bonding the bonding strip. In one embodiment, the method also includes clamping, with a sole clamp, the bonding strip, thereby limiting warpage of the bonding strip.

System and method for dual head bonding

The invention includes an XYZ stage 100 for positioning an object 140 in an X direction, a Y direction orthogonal to said X direction, and a Z direction orthogonal to both said X and Y directions. The stage 100 comprises a generally horizontal movable stage 104, a stationary X motor connected to said movable stage 104 for moving said stage in an X direction, a stationary Y motor 106 movably connected to said movable stage 104 for moving the stage 102 in a Y direction independently of the X direction, wherein the stage 100 has an L shaped bell crank 132 having an outside corner pivotally mounted on the stage 104 so that the bell crank 132 is rotatable in a vertical plane through the stage about an axis in the X direction, and a stationary Z axis motor connected to one end of the bell crank for movement of this one end in a Y direction. The other end of the bell crank thus moves in a Z direction.

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Dallas, TX, United States of America

Larry D Giaudrone