Hutchinson Technology Corporation

Larry C Webb, Jr

Craig A Leabch

Mark A Miller

Raymond R Wolter

Stevenson J Marek

Anthony J Liberko

Steven R Lagergren

Michael E Roen

Keith W Carlson

Marc A Even

Dennis A Boismier

Galen D Houk

Valerie J Webber

An integrated lead flexure or suspension including an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The traces are free of a conductive shield layer on the side opposite the insulating layer. One or more voids extend through the stainless steel layer below the traces. The voids are filled with a high conductivity metal layer.

High conductivity ground planes for integrated lead suspensions

A webbed ground plane includes a plurality of slots and a plurality of struts between the slots. The slots and struts have generally equal lengths and extend below a length of the leads such that eddy current losses in the leads are reduced to near zero.

Webbed ground plane structure for integrated lead suspensions

An integrated lead flexure having a slotted coverlay to compensate for curling caused by thermal and hygroscopic-induced expansion and contraction of the coverlay.

Flexible electrical circuit with slotted coverlay

Apparatus and method for grounding a flexure of a head suspension assembly to a moving support such as an actuator arm or an E block close to a preamplifier, write driver or other wiring such as a flexible circuit located on the moving support in a disk drive assembly, including connecting a metal substrate layer of the flexure to a ground on the moving support closely adjacent the preamplifier or flexible circuit to minimize ground loop interference with signals on the traces. The invention includes a variety of arrangements to secure the metal substrate layer to the moving support.

Ground interconnects

A switchable shunt has an insulating layer separating conductive lead and spring metal layers. The shunt includes a base region formed on the spring metal layer, one or more arms formed in the conductive lead layer and at least one of the insulating and spring metal layers, one or more pad regions electrically coupled to an arm and formed in at least the conductive lead layer, and one or more gaps. Each arm extends through a gap and is resiliently biased toward a shunted state with the pad region in electrical contact with the base region. The shunt is movable to an electrically open state where the pad and base regions are electrically isolated. A method of making the shunt includes etching the shunt from laminated material and pushing the arm and pad through the gap. The shunt may be operated by applying a force to the arm.

Method of making switchable shunts for integrated lead suspensions

A method of adjusting the common mode impedance while enabling maintenance of the differential mode impedance of a pair of traces located with respect to a ground plane formed by a load beam or trace assembly of a disk drive head suspension. The method includes forming a ground plane having apertures with isolated conductive islands in the apertures for setting a desired common mode impedance. The method includes a cut and try approach using sample coupons to adjust the ratio of backed area to island area to adjust the common mode impedance while maintaining the differential mode impedance by maintaining the ratio of unbacked area to the sum of the backed and island areas.

Method for controlling common mode impedance in disk drive head suspensions

Method of operating switchable shunts for integrated lead suspensions

Apparatus and method of adjusting the common mode impedance while enabling maintenance of the differential mode impedance of a pair of traces located with respect to a ground plane formed by a load beam or trace assembly of a disk drive head suspension. The ground plane has apertures with isolated conductive islands in the apertures for setting a desired common mode impedance. The method includes a cut and try approach using sample coupons to adjust the ratio of backed area to island area to adjust the common mode impedance while maintaining the differential mode impedance by maintaining the ratio of unbacked area to the sum of the backed and island areas.

Apparatus and method for controlling common mode impedance in disk drive head suspensions

A method for efficiently producing low resistance electrical contacts between stainless steel and conductive layers in integrated lead suspensions and components. The method includes applying an amount of current for a period of time which is effective to reduce the resistance to a desired level. One embodiment of the invention includes applying a 100 mA current for 16 msec to a contact formed by thermosetting conductive epoxy. Resistance levels below 1 ohm can be achieved.

Growing community of inventors

Hutchinson, MN, United States of America

Larry C Webb, Jr