International Business Machines Corporation

Lara Sandra Collins

Cyprian Emeka Uzoh

Daniel C Edelstein

Hariklia Deligianni

Erick G Walton

Peter Stevens Locke

James Edward Fluegel

Dean S Chung

William E Corbin, Jr

Josef W Korejwa

A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. The compressible member is porous so as to absorb the plating solution and transmit the plating solution to the substrate. The wafer and compressible member may rotate with respect to each other. The compressible member may be at cathode potential or may be a passive circuit element.

Electroplating apparatus and method using a compressible contact

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Georgia, VT, United States of America

Lara Sandra Collins