Asm Assembly Automation Limited

Lap Kei Eric Chow

Chi Wah Cheng

Ching Man Stanley Tsui

Pei Wei Tsai

Chak Tong Albert Sze

Hoi Shuen Tang

Tim Wai Tony Mak

Wang Lung Alan Tse

Chi Hang Leung

Hon Keung Lai

M Bilan Curito, Jr

A nozzle device comprising a nozzle chamber includes a fluid inlet located at a first side of the nozzle chamber which is operative to introduce fluid into the nozzle chamber in an injection direction and a fluid outlet at a second side of the nozzle chamber which is operative to expel fluid from the nozzle chamber. A high frequency wave generator is also located in the nozzle chamber which is oriented and operative to generate high frequency waves in a direction which is substantially parallel to the injection direction, whereby to impart high frequency energy to the fluid in the nozzle chamber.

Nozzle device employing high frequency wave energy

A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.

Handling system for inspecting and sorting electronic components

Singulation handler is provided which comprises a loading zone where a carrier mechanism receives and holds an electronic component and a singulation zone where the electronic component held by the carrier mechanism is singulated. A loader that is movable along an axis is operative to place the electronic component onto the carrier mechanism when it is situated in the loading zone and a vision system that is movable along substantially the same axis as the loader is operative to obtain at least one image of the electronic component showing alignment information so that the electronic component can be properly aligned during singulation.

Singulation handler comprising vision system

A singulation system for a workpiece has a carrier for mounting the workpiece during singulation and a receptacle for collecting debris formed. A driving mechanism, which is operative to move the carrier and the workpiece, is at least partially covered by a bellows. A bellows protecting cover extending over the bellows is coupled between the carrier and the receptacle and is operative to guide debris from the carrier along its longitudinal length towards the receptacle. The bellows protecting cover further comprises side walls extending along opposite sides of its longitudinal length to prevent debris from falling off its sides.

Drainage apparatus for a singulation system

A method of detecting wear and damage to a rotary cutting blade for singulating a substrate is provided comprising the steps of providing a sensor to locate a first detecting position at an edge of the blade and performing dicing with the blade while the sensor is maintained substantially at the first detecting position for detecting damage to the blade. Subsequently, an extent of wear of the blade is determined by driving the sensor in the direction of the blade to locate a second detecting position at the edge of the blade as a diameter of the blade is reduced due to dicing. Thereafter, while dicing is performed with the blade, the sensor is maintained substantially at the second detecting position for detecting damage to the blade.

Damage and wear detection for rotary cutting blades

The invention provides a mechanism for a test handler using for electrical testing of electronic devices. The devices are placed on a platform configured to move semiconductor devices from an onloading position to an offloading position along a predetermined path. A transfer arm with a plurality of transfer heads connected to it is located adjacent the path. The transfer heads are configured to pick up and transfer semiconductor devices from the platform to a testing position for testing, and thereafter to transfer the semiconductor devices from the testing position to the platform for offloading.

Device transfer mechanism for a test handler

The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.

Growing community of inventors

Hong Kong, China

Lap Kei Eric Chow