Vlt Corporation

Lance L Andrus

Patrizio Vinciarelli

Fred M Finnemore

George J Ead

Robert E Belland

Craig R Davidson

Cruz R Calderon

Jeffrey A Curhan

Charles Steven Skoolicas

Charles Francis Hutchins

A multiconductor snake wiring system which uses a flexible bus structure with taps for providing connections to the components is disclosed. An automated facility for manufacturing the snake wiring system is also described. A compact multilayer wiring structure for connecting the components and a unique process for manufacturing the wiring structure are also disclosed.

Interconnection system

A shield is applied to a permeable core in a predetermined pattern, where the predetermined pattern covers less than the entire surface area of the permeable core.

Plating permeable cores

A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap. A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A method for use in making a package for electrical circuits includes attaching an electrical insulator within a recess of a first metallic component. The method also includes registering a second metallic component within the recess using a template tool and bonding the second metallic component to the insulator. A third component is soldered to the second metallic component. A structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor.

Packaging electrical circuits

A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap. A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A method for use in making a package for electrical circuits includes attaching an electrical insulator within a recess of a first metallic component. The method also includes registering a second metallic component within the recess using a template tool and bonding the second metallic component to the insulator. A third component is soldered to the second metallic component. A structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor

A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator is set forth. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A further structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor is presented.

A heat generating component is encapsulated within an encapsulant. A window is made in the encapsulant to expose a heat dissipating surface of the component and a heat sinking device is attached to the heat dissipating surface of the heat generating component. The window is formed using a laser.

Growing community of inventors

Southboro, MA, United States of America

Lance L Andrus