Solar Junction Corporation

Lan Zhang

Ewelina Natalia Lucow

Ferran Suarez

Sathya Chary

Sabeur Siala

Michael West Wiemer

Onur Fidaner

Ali Torabi

This disclosure relates to semiconductor devices and methods for fabricating semiconductor devices. Particularly, the disclosure relates to back-contact-only multijunction solar cells and the process flows for making such solar cells, including a wet etch process that removes semiconductor materials non-selectively without major differences in etch rates between heteroepitaxial III-V semiconductor layers.

Via etch method for back contact multijunction solar cells

Photovoltaic cells, methods for fabricating surface mount multijunction photovoltaic cells, methods for assembling solar panels, and solar panels comprising photovoltaic cells are disclosed. The surface mount multijunction photovoltaic cells include through-wafer-vias for interconnecting the front surface epitaxial layer to a contact pad on the back surface. The through-wafer-vias are formed using a wet etch process that removes semiconductor materials non-selectively without major differences in etch rates between heteroepitaxial III-V semiconductor layers.

Surface mount solar cell with integrated coverglass

A semiconductor light detection device fabrication technique is provided in which the cap etch and anti-reflection coating steps are performed in a single, self-aligned lithography module.

Method for making semiconductor light detection devices

Growing community of inventors

Palo Alto, CA, United States of America

Lan Zhang