Macronix International Co., Ltd.

Lan Ting Huang

Po Hsuan Wu

Ling Kuey Yang

Chen-Chin Liu

Chen Chin Liu

Wen-Jer Tsai

Nian-Kai Zous

Ta-Hui Wang

Fu Shiung Hsu

A method for fabricating a floating gate memory device comprises using a buried diffusion oxide that is below the floating gate thereby producing an increased step height between the floating gate and the buried diffusion oxide. The increased step height can produce a higher GCR, while still allowing decreased cell size using a virtual ground array design.

Apparatus and associated method for making a floating gate cell with increased overlay between the control gate and floating gate

A BLT can include a different channel length, channel width, or both to compensate for bit line loading effects. The channel length and/or channel width of the transistor structure can be configured so as to achieve a desired loading. Thus, the bit line transistor structure can improve global metal bit line loading uniformity and provide greater uniformity in bit line bias. Additionally, the greater uniformity in bit line bias can improve reliability.

Bit line selection transistor layout structure

A method for forming a non-volatile memory cell includes depositing an oxide layer over a component stack including a dielectric layer over a first conductive layer. A portion of an upper section of the oxide layer is removed such that the dielectric layer is exposed. The dielectric layer and a remainder of the oxide layer upper section are removed such that upper surfaces of the oxide layer and the first conductive layer are substantially planar. A second conductive layer is formed over the upper surfaces of the first conductive layer and the oxide layer. A non-volatile memory array is formed including multiple spaced and parallel bit lines in a substrate surface. Multiple stacked layers, including an electron trapping layer, are on the substrate surface over the bit lines. Multiple spaced word lines are over the stacked layers. The word lines are parallel to one another and perpendicular to the bit lines.

Method for forming non-volatile memory cell with low-temperature-formed dielectric between word and bit lines, and non-volatile memory array including such memory cells

A reliability test method for a non-volatile memory. A relation curve of gate voltage versus read current degradation rate is obtained. The read current degradation rate of an actual gate voltage is estimated. From the relation curve, an accelerated test gate voltage and a test time corresponding to the actual gate voltage are obtained. With the accelerated test gate voltage, the test is continuously performed within the test time. Afterward, a test result of the memory is then obtained and, by the result, it is judged whether the data is valid or not. If the data is right (retained), the memory can be guarantied to have an expected lifetime; if the data is wrong (lost), the memory is judged as fails to pass the lifetime test.

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Kaohsiung, Taiwan

Lan Ting Huang