Qualcomm Incorporated

Lan Nan

Zhang Jin

Darryl Sheldon Jessie

Thomas Myers

Maulin Pareshbhai Bhagat

In an integrated circuit package that houses radio-frequency (RF) circuits or components using wafer-level packaging (WLP), an RF-signal transmission structure includes a signal-carrying conductive line positioned between grounded conductive lines to avoid undesirable coupling between the signal-carrying conductive line and other RF circuits or components in the same package.

Transmission line implementation in wafer-level packaging

A tunable guard ring for improved circuit isolation is disclosed. In an exemplary embodiment, an apparatus includes a closed loop guard ring formed on an integrated circuit and magnetically coupled by a selected coupling factor to a first inductor formed on the integrated circuit. The apparatus also includes a tunable capacitor forming a portion of the closed loop guard ring and configured to reduce magnetic field coupling from the first inductor to a second inductor.

Growing community of inventors

San Diego, CA, United States of America

Lan Nan