Soltec B.v.

Lambertus P Willemen

John Norton

Allan Lance Larrabee

James J Andrus

A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting, at a desired temperature which can be set using a heater and one or more thermo measuring devices, a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The tool comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board. The tool targets only those areas of the board where bridges or excess solder repeatedly form during the soldering process without disturbing solder joints where no bridges or excess solder form. Since the debridging tool is positioned close to the wave soldering station, the latent heat from the soldering process remains in the printed circuit board, and the gas mass is relatively small, the pressurized stream may be kept below the temperature of molten solder. An inert environment around the selective debridging tool and the wave soldering station may be used to reduce the oxidation of the solder and reduce the formation of dross in the solder pot. The main soldering tower of the wave soldering station may have a removable insert with a non-round roller for generating a turbulent wave in the main soldering tower when the insert is installed.

Movable selective debridging apparatus for debridging soldered joints on printed circuit boards

A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The debridging tool, which comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board, targets only those areas of the board where bridges or excess solder repeatedly forms during the soldering process without disturbing solder joints where no bridges or excess solder form. More than one movable nozzle may be used where warranted. Since the debridging tool is positioned so closely to the wave soldering station and the latent heat from the soldering process remains in the printed circuit board, and the gas mass is relatively small, the stream of air, gas or other fluid used for solder removal may be kept below the temperature of molten solder. The debridging tool also permits the stream to be emitted at a first pressure under a first area where solder is to be removed and at a second pressure under a second area where solder is to be removed.

Movable selective debridging apparatus and method of debridging soldered

An apparatus for applying solder enhancing liquid flux to objects for soldering including a fluxer wherein the density of the liquid flux supplied to the fluxer is controlled by a device for determining the density intermediately a flux storage container, and the fluxer; the density determining device producing an output signal whereby the quantity of diluent supplied to a liquid flux storage container is controlled. The density determining device includes a liquid flux pressure measurer with a vessel extending thereabove which includes an overflow to maintain constant flux liquid level therein.

Solder fluxer with liquid flux density control

The invention relates to a device for measuring the height of a solder wave in a soldering apparatus which comprises a solder bath and which is provided with at least one solder tower for generating a solder wave and a pump connected to the solder tower, wherein the measuring device comprises: means for measuring the liquid pressure in the connection between the pump and the solder tower. As a result of these steps it is possible to measure accurately the pressure of the solder moving out of the pump to the solder tower. This pressure is in any case a good measure for the height of the solder wave. According to a first preferred embodiment the means for measuring the liquid pressure comprise a measuring vessel joined to the connection between pump and tower and communicating at its top with the atmosphere, the upper edge of which vessel is located higher than the outflow opening of the solder tower.

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Dorst, Netherlands

Lambertus P Willemen