Intel Corporation

Saint-gobain Performance Plastics Corporation

Lakshmi Supriya

James Chris Matayabas, Jr

Leonel R Arana

Anna M Prakash

Nirupama Chakrapani

Jessica A Weninger

Lateef Mustapha

Ravi Kiran Nalla

Daewoong Suh

Omar James Bchir

Linda A Shekhawat

Christopher M Comeaux

Gloria Alejandra Camacho-Bragado

Mathilde Leboeuf

Tommy Ashton, Ii

Tommy L Ashton

A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarity, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

Controlled fluid delivery in a microelectronic package

A polymer article includes a meltprocessable blend of a melt-viscid fluoropolymer and a liquid crystalline polymer. Methods are presented for preparing a meltprocessable blend from a melt-viscid fluoropolymer and liquid crystalline polymer.

Meltprocessed fluoropolymer article and method for melt-processing fluoropolymers

A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).

Thermally conductive device with a thermal interface material

Methods of processing a thermal interface material

Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.

Apparatus and methods of forming an interconnect between a workpiece and substrate

Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of functionalized nanaparticles on a substrate by immersing the substrate in at least one of a solvent and a polymer matrix, wherein at least one of the solvent and the polymer matrix comprises a plurality of functionalized nanoparticles; and forming a second layer of functionalized nanoparticles on the first layer of functionalized particles, wherein there is a gradient in a property between the first layer and the second layer.

Methods to fabricate functionally gradient materials and structures formed thereby

A method of forming an interconnect joint includes providing a first metal layer (), providing a film () including metal particles () and organic molecules (), placing the film over the first metal layer, placing a second metal layer () over the film, and sintering the metal particles such that the organic molecules degrade and the first metal layer and the second metal layer are joined together.

Method of forming an interconnect joint

A multiple die structure includes a first die (), a second die (), a carbon nanotube () having a first end () in physical contact with the first die and having a second end () in physical contact with the second die, and an electrically conductive material () in physical contact with the first end of the carbon nanotube and in physical contact with the first die. Forming a connection between the first die and the second die can include providing a connection structure () in which the electrically conductive material is adjacent to the carbon nanotube, placing the connection structure adjacent to the first die and to the second die, and bonding the first die and the second die to the connection structure.

Multiple die structure and method of forming a connection between first and second dies in same

In one embodiment, the present invention includes a method for forming a sacrificial material layer, patterning it to obtain a first patterned sacrificial material layer, embedding the first patterned sacrificial material layer into a dielectric material, treating the first patterned sacrificial material layer to remove it to thus provide a patterned dielectric layer having a plurality of openings in which vias may be formed. Other embodiments are described and claimed.

Forming vias using sacrificial material

Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the solder microballs on the bonding pads. The method also includes heating the solder microballs to reflow and form a joint between the solder microballs and the bonding pads. Other embodiments are described and claimed.

Microball attachment using self-assembly for substrate bumping

Methods and systems for forming holes in a substrate using dewetting coating are described herein.

Growing community of inventors

Chandler, AZ, United States of America

Lakshmi Supriya