Visteon Global Tech., Inc

Ford Motor Company Limited

Visteon Global Technolgoies, Inc.

Lakhi Nandial Goenka

Marc Alan Straub

Vivek Amir Jairazbhoy

Malgorzata M Skender

Frank Burke DiPiazza

Randy Claude Stevenson

Mohan R Paruchuri

A circuit component secured to a printed circuit board typically uses fine wires for completing the circuit from the printed circuit to the component. The component may be an integrated circuit having one or more pads thereon for receiving the wire. A device and method for making the device has the printed circuit formed on the PCB with one or more wire traces that are etched away from the printed circuit. The etchant removes a portion of the bottom layer and sometimes the middle layer of an etched tri-metal along with any lamination and adhesive. This forms a free end of the wire trace that is bonded to the component. Additional wires are not required.

Etched tri-metal with integrated wire traces for wire bonding

A nozzle having a material outlet aperture which causes received material to be emitted in the form of a streaming sheet

Nozzle

A nozzle assembly,having shroud members,which selectively emit a material,along at least one edge of emitted material,. The selectively emitted material,substantially prevents and/or eliminates the turbulent shear layer which is formed within the emitted material

Nozzle assembly

A nozzle,having an outlet aperture,, the outlet aperture,having at least one injector,which is disposed within the aperture,and which injects a material,within the aperture,, effective to allow the material to be atomized and to be emitted from the aperture,at a substantially identical velocity at each point within the aperture

An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

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Ann Arbor, MI, United States of America

Lakhi Nandial Goenka