Visteon Global Technolgoies, Inc.

Lakhi N Goenke

Jay DeAvis Baker

Achyuta Achari

Mark David Miller

Charles Frederick Schweitzer

Karen Lee Chiles

Shona Bullock, Legal Representative

Jason Bullock, Legal Representative

A system and method for reflowing solder to interconnect a plurality of electronic components () to a substrate () is disclosed. The system includes an oven for preheating the substrate () and the plurality of electronic components () disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (), a pallet () for supporting the substrate (), wherein the pallet () has at least one internal cavity (), and a phase-transition material () disposed within the cavity () for absorbing heat from the pallet ().

System and method for mounting electronic components onto flexible substrates

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Ann Arbor, MI, United States of America

Lakhi N Goenke