International Business Machines Corporation

Jds Uniphase Corporation

Ladd William Freitag

Benson Chan

Paul Francis Fortier

Matthew James Paschal

John Henry Sherman

Glen Walden Johnson

David W Siljenberg

Kevin Paul Demsky

Timothy Roy Block

Ronald L Soderstrom

Real Joseph Tetreault

Gerald M Heiling

Francois Guindon

Dennis L Karst

John T Trnka

Martial A Letourneau

Gary T Galli

Marcia B Ebler

Spencer C Holter

How Tzu Lin

Richard Ronald Hall

David Peter Gaio

Mitchell S Cohen

Michael Francis Hanley

Scott Michael Branch

Raymond J Thatcher

Daniel Scott Hedin

Eugene E Distad

London Terry Brown

An on-chip parallel data generator, including a Built In Self Test (BIST) generator, is integrated into a laser driver array of a parallel optical communication transmitter so that all optical outputs switch simultaneously. The BIST generator requires only one clock input which clocks the BIST generator for all channels. The optical outputs respond to either the on-chip BIST generator or the electrical inputs if a valid signal is present on the inputs.

Built in self test method and circuit for parallel optical transmitters

The invention relates to modular heat-dissipating housing covers for opto-electronic modules, e.g. transceivers. The housing covers according to the present invention are constructed out of various different parts, which provide different levels of heat dissipation depending on the desired implementation, while maintaining a seal against EMI leakage. Extra heat sinking portions are provided to dissipate heat generated from specific heat generating sources. The extra heat sinking portions are configured into a shape and/or out of a material that provides more thermal dissipation than the standard cover provided. Independent control over the different heat sinking portions enables a better fit and appropriate dissipation.

Modular heat sinks

A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Assembly of opto-electronic module with improved heat sink

A method and apparatus are provided to ensure that laser optical power does not exceed a &ldquo;safe&rdquo; level in a DC coupled open loop parallel optical link in the event that a fiber optic ribbon cable is broken or otherwise severed. A duplex parallel optical link includes a transmitter and receiver pair and a fiber optic ribbon that includes a designated number N of channels that cannot be split. The duplex transceiver includes a corresponding transmitter and receiver that are physically attached to each other and cannot be detached therefrom, so as to ensure safe, laser optical power in the event that the fiber optic ribbon cable is broken or severed. Safe optical power is ensured by redundant current and voltage safety checks, and the corresponding low duty cycle signal is generated by a safety pulse generator in the safety channel.

Laser safety method for DC coupled parallel optical link

A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

Fiber optic connections and method for using same

Optical power adjustment is provided for parallel optical transmitters, in particular, for an array of vertical cavity surface emitting lasers (VCSEL's). The lasers in the array can be independently digitally adjusted with associated digital circuitry to compensate for manufacturing and temperature variations. In particular, the threshold current and modulation current for each VCSEL in the array, as well as a global temperature coefficient for all the VCSEL's in the array, can be digitally setup and adjusted for desired power levels. Once set, the associated digital code can be stored in non-volatile memory, and loaded at powering-up of the transmitters.

Optical power adjustment circuits for parallel optical transmitters

A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

A method and apparatus are provided for laser safety. A fault detector detects laser fault conditions and generates a laser fault control signal. A laser fault counter is coupled to the fault detector for counting laser fault conditions and for generating a disable laser control signal responsive to a predetermined fault count. A reset timer is coupled to the laser fault counter for identifying a predetermined reset time period responsive to the laser fault control signal and applying a reset signal to the laser fault counter. Features of laser safety method and apparatus of the invention are that the laser fault counter is reset if a second laser fault condition is not detected within the predetermined reset time period after the laser is turned on. The disable laser control signal is not generated when a safe laser optical power condition occurs between two laser fault conditions.

Method and apparatus for laser safety

An optical fiber link card communication module, and process for fabricating the module, where the module provides a parallel electrical interface to the user, facilitates high speed serial transmission of data over an optical data link, and contains a plurality of converters for performing conversions between both electrical and optical signals. A preferred embodiment of the invention contemplates fabricating the optical communication module on a single multilayer card with all the transmitter electrical components being located on one side of the card, all receiver electrical components being located on the other side of the card, and the transmitter and receiver components being separated by shielding layers in the card. By using two transmitter/receiver pairs (with the transmitters and receivers being located on respective sides of the card) an embodiment of the invention provides for double full duplex communications.

Optical fiber link card

An optical fiber link card communication module, and process for fabricating the module, where the module provides a parallel electrical interface to the user, facilitates high speed serial transmission of data over an optical data link, and contains a plurality of converters for performing conversions between both electrical and optical signals. The module further includes edge mounted optical components having leads mounted on the surface of a card (as opposed to standard pin-in-hole type leads) to minimize lead capacitance and inductance from the optical components to the card electronics, on board card control means for the converters and safety shut down means on the same card as the electrical and optical components.

Growing community of inventors

Rochester, MN, United States of America

Ladd William Freitag