International Business Machines Corporation

L Wynn Herron

John Ulrich Knickerbocker

David Clifford Long

Hilton T Toy

Sudipta Kumar Ray

How Tzu Lin

Mario John Interrante

Subhash Laxman Shinde

Steven Paul Ostrander

Robert Anthony Rita

William Edward Sablinski

Dinesh Gupta

Jawahar P Nayak

Jae M Park

Scott G Ehrenberg

Ekkehard F Miersch

Janet L Poetzinger

An optical-electronic package for an electronic device provides electrical connections to the electronic device and optical fiber connections to the electronic device. The package includes a high thermal conductivity base which has a pedestal to support and provide heat transfer connection to the electronic device. A seal band is formed on the base and a casing is bonded to the seal band. The casing has side feedthroughs for the electrical connections from the electronic device, and the casing has top feedthroughs or grooves for the optical fiber connections from the electronic device. A lid is hermetically sealed to the top of the casing. The lid has retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing. The retractable means for forming a bend in the optical fibers is retractable once the lid is sealed on the casing.

Optoelectronic package structure and process for planar passive optical and optoelectronic devices

In the formation of multilayer ceramic substrates, greensheets are utilized which have the same pattern and number of vias punched in each greensheet. Then, selected vias may be filled with metallic paste to form the internal connections of the multilayer ceramic substrate. The remaining vias may be filled with a fugitive material or left totally unfilled. Also disclosed is the multilayer ceramic substrate produced by this method.

Method of forming a multilayer ceramic substrate with max-punched vias

A multilayer, three-dimensional wiring matrix is fabricated from a plurality of individually testable plane pair sub-units (30). Each of the plane pair sub-units (30) includes a compensator (20) with capping layers (32) laminated on either side. The compensator (20) has a dielectric (14) encapsulated foil (10) which has been patterned with holes (12). Metallization patterns on the surfaces of the compensator (20) provide orthogonal wiring (22), electrical connections (24) to the foil (10), and electrical connections (26) between the top and bottom surfaces. The capping layer (32) includes joining metallurgy (38) at selected locations within a dielectric layer (36) that is in registry with the metallization in the vias (16). The joining metallurgy (38) may be a metal loaded thermoplastic and provides a seal for the vias (16) as well as planarizes the structure. The capping layers (32) may be formed in-situ on the compensator or separately.

Discrete fabrication of multi-layer thin film, wiring structures

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New Paltz, NY, United States of America

L Wynn Herron