Advanced Micro Devices Corporation

L K Suresh

Sally Foong

Kanchit Suphanpeasat

Segmentation of a flexible, elongated, strip-shaped substrate having a plurality of encapsulated semiconductor devices mounted thereon, for device singulation, is facilitated by pre-cutting pairs of slots through the substrate at each device mounting area, which slots minimize the amount of substrate material required to be removed during device singulation. Disadvantageous penetration of the slots by liquid encapsulant material is substantially prevented, or at least minimized, by forming slots having burrs or flaps at the upper, mounting surface of the substrate which seal off, or substantially reduce the width of the slots.

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Sunnyvale, CA, United States of America

L K Suresh