Amkor Technology, Inc.

KyungRok Park

Roger D St Amand

Vladimir Perelman

YounSang Kim

ChangSuk Han

A film-on-wire spacer covers an entire upper surface of a lower electronic component. Accordingly, an upper electronic component is supported above bond pads and lower bond wires of the lower electronic component. This decreases the stress on the upper electronic component, e.g., during wirebonding, and thus decreases the chance of cracking the upper electronic component. Further, the lower bond wires are enclosed in and protected by the film-on-wire spacer. Further, the film-on-wire spacer is thin resulting in a minimum height of the stacked electronic component package.

Growing community of inventors

Kwangju, South Korea

KyungRok Park