Samsung Electronics Co., Ltd.

Kyungpook National University Industry-Academic Cooperation Foundation

Kyungil Cho

Jong Keun Song

Youngil Kim

Baehyung Kim

Seungheun Lee

Minseog Choi

Kyuhong Kim

Eunsung Lee

Suhyun Park

Yongrae Roh

Taeho Jeon

The ultrasonic diagnostic apparatus includes an ultrasonic transducer array in which ultrasonic transducer elements are two-dimensionally arranged; and a controller configured to control the ultrasonic transducer elements to transmit ultrasonic signals and control the ultrasonic transducer elements arranged in rows of the ultrasonic transducer array to sequentially receive ultrasonic echo signals.

Ultrasonic diagnostic apparatus and control method thereof

Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housing; a heat pipe configured to transfer the heat generated by the transducer; a radiator connected to the heat pipe and configured to release the heat, which is transferred via the heat pipe, to the exterior of the housing; and a partition wall configured to separate an inside space within the housing.

Ultrasonic probe

An ultrasonic probe includes a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves, an integrated circuit to which the cMUT array is bonded, and a flexible printed circuit board having one end connected to the integrated circuit to output signals to the integrated circuit, the integrated circuit including pads provided on the integrated circuit and an anisotropic conductive film (ACF) provided on the pads, and the one end of the flexible printed circuit board being connected to the ACF to thereby connect the flexible printed circuit board to the integrated circuit.

Ultrasonic probe and manufacturing method thereof

A probe includes a transducer array including a transducer element, the transducer element including cells connected in parallel to each other, and a current detector configured to apply a voltage to the cells of the transducer element, or to output an electrical signal based on currents output from the cells.

Probe, ultrasound imaging apparatus, and control method of the ultrasound imaging apparatus

An ultrasonic probe includes: a housing having an opening provided at a first end portion of the housing; a transducer provided in a position corresponding to the opening and configured to generate ultrasonic waves; a heat spreader provided underneath the transducer; and a printed circuit board (PCB) disposed between the transducer and the heat spreader, wherein the heat spreader includes: a body portion configured to absorb heat from the transducer; and a coupling portion that is formed at a side portion of the body portion and coupled to the housing.

Disclosed herein are an ultrasonic apparatus for imaging an ultrasonic signal and a control method for the same. The ultrasonic apparatus may include a transducer configured to irradiate a plurality of ultrasonic waves which have different traveling directions onto an object and to collect a plurality of echo ultrasonic waves reflected from the object; and a controller configured to acquire a plurality of sound velocities of the plurality of ultrasonic waves in the object and to compound the acquired plurality of sound velocities in order to determine a composite sound velocity in the object.

Ultrasonic apparatus and control method for the same

A beamforming apparatus includes: a signal output unit configured to output signals; a time difference corrector configured to correct a time difference between the signals; and a weight applier configured to apply a weight value to the signals, according to an error between the signals with the corrected time difference and a target delay pattern.

Growing community of inventors

Seoul, South Korea

Kyungil Cho