Samwon Act Co., Ltd.

Other

Emot Co., Ltd.

Korea Institute of Materials Science

Kyung Yul Lee

Kyung Wook Lee

Hong Suk Han

Jae Sung Choi

Jun Sang Jeong

Man Kim

Sang Yeoul Lee

Wayne H Choe

Joo Yul Lee

Yang Seok Lee

Bong Yul Lee

Doo Yul Baek

Kwang Jong Choi

Pyoung Woo Lee

Hong Seok Han

The present invention is configured as follows. The present invention relates to a system wall characterized by comprising: a bracket attached to a wall part; a support attached to the bracket; a hole-processed metal panel corresponding to the support; and a decorative part inserted into the support protruding from the hole-processed metal panel.

System wall for building interior

The present invention has the following configuration. The present invention relates to a wirable bracket attached to a wall body, the bracket being characterized by comprising: a rib which is bound to an upper portion of the bracket by inserting a metal panel; and a wiring part inserted into a hollow space section formed in the rib.

Wirable bracket and module coupling device coupled thereto

The present invention has the following features. The present invention relates to a flammable flame-proof material provided with a metal material, comprising a metal material and a non-flame-proof-treated thin film sheet on the top of the metal material, wherein an adhesive agent is between the metal material and the non-flame-proof-treated thin film sheet, and relates to an attachment structure for attaching a metal plate with a flammable thin-film construction interior material.

Metal material to which flammable thin-film construction interior material is adhered, and attachment structure for attaching same

The present disclosure has the following configurations. The present disclosure relates to a unit bracket in a square shape, in which outer surfaces of four surfaces of the unit bracket are formed with locking projections configured to insert a metal or plastic panel, and a center portion of the unit bracket is formed with a mesh part to be formed such that the bonding is possible at a vertical tensile strength and a horizontal tensile strength having desired forces even if the unit bracket and a wall or a base material are bonded with an adhesive, in order to bond the unit bracket to the wall or the base material.

Unit bracket, bracket and bracket construction method for attaching to base material and wall using the same

Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).

Method for manufacturing FCCL capable of controlling flexibility and stiffness of conductive pattern

The present disclosure relates to interior material attachment structure with wall attachment part bolt grooves, including: binding protrusions formed at the outermost part of the interior material attachment structure in order to attach the metal interior material; and connection part grooves formed adjacent to the binding protrusions in order to connect the plurality of interior material attachment structures to each other.

Metal interior material and interior material attachment structure

The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.

Circuit board

Building interior material

Connection bracket of building interior material

According to an embodiment of the present invention, a method for producing a duplicate of a nano-pattern texture of a surface of an object through electroforming using an imprint mold comprises selecting the object having the nano-pattern texture, disposing the selected object and pretreating a surface of the object by washing, drying and then forming a nano-thin film thereto to block transfer of impurities, metallizing a surface of the plastic mold through, e.g., vapor deposition, spraying, and wet silver mirror reaction, and performing a first electroforming of the surface of the plastic mold, and repeating to thus manufacture a plurality of metal module master molds.

Method of duplicating nano pattern texture on object's surface by nano imprinting and electroforming

Provided are a structure color of photonic crystals in which a new structure of a structure color of photonic crystals is provided so that a nanoimprint process can be performed and mass productivity is improved, a method of manufacturing thereof, and a manufacturing apparatus thereof. The method of manufacturing a structure color of photonic crystals includes: forming a plurality of basic element layers by using nanoimprinting, the plurality of basic element layers comprising a plurality of basic unit bodies each having a symmetrical cross-section and thin film connecting portions connecting the basic unit bodies! sequentially stacking the basic element layers! removing the thin film connecting portions by using etching; and determining whether the structure color of photonic crystals is completed, wherein, when it is determined that the structure color of photonic crystals is not completed, the forming, the stacking, and the removing are repeatedly performed.

Growing community of inventors

Bucheon-si, South Korea

Kyung Yul Lee