Korea Advanced Institute of Science and Technology

Optopac Co., Ltd.

Micropack Co., Ltd.

Kyung Wook Paik

Myung Jin Yim

Deok Hoon Kim

Jae Woong Nah

Dal-Jin Yoon

Sung Dong Cho

Young Doo Jeon

Jae Ok Kim

Kyung Woon Jang

Kyoung Lim Suk

Junho Byeon

Se Young Jang

Woon Seong Kwon

Disclosed are a method of uniformly dispersing nickel-plated conductive particles of a single layer within a polymer film by applying a magnetic field to the polymer film and a method of fabricating an anisotropic conductive film using the same. The method of fabricating a film may include forming a liquefied polymer layer by roll-to-roll coating a polymer solution in which a plurality of conductive particles has been mixed, dispersing the plurality of conductive particles included in the liquefied polymer layer by applying a magnetic field to the liquefied polymer layer, and fabricating a solid polymer layer limiting a movement of the plurality of dispersed conductive particles by drying the liquefied polymer layer in which the plurality of conductive particles has been dispersed.

Method of uniformly dispersing nickel-plated conductive particles of single layer within polymer film by applying magnetic field to polymer film and method of fabricating anisotropic conductive film using the same

Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

Fiber, fiber aggregate and adhesive having the same

A polymer/ceramic composite paste for an embedded capacitor includes an organic solvent, a ceramic powder having a particle diameter of not more than 20 &#x3bc;m dispersed in the organic solvent, a polymer and a hardener. The use of the polymer/ceramic composite paste enables the formation of a dielectric layer having a high dielectric constant. The polymer/ceramic composite paste can be applied by a screen printing technique and is planarized to locally form a polymer/ceramic composite dielectric layer having a thickness of, e.g., up to 20 &#x3bc;m on a desired region. Accordingly, electrical parasitics resulting from the formation of a capacitor on unwanted regions can be reduced, and the capacitance error can be reduced.

Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same

Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 &#x3bc;m and optionally non-conductive particles having a particle size of 0.1 to 1 &#x3bc;m; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film.

High adhesion triple layered anisotropic conductive adhesive film

Disclosed is a method for manufacturing a low dielectric constant conductive adhesive that is appropriate for a radio frequency packaging application. This method is characterized by mixing a thermosetting resin with surface-treated conductive particles and non-conductive particles for prevention of agglutination and thereby forming the conductive adhesive. The manufactured conductive adhesive is useful for a bonding material of the radio frequency packaging. According to the present invention, it is possible to obtain a flip chip bonding having superior mechanical and electrical performance compared with the conventional flip chip bonding art. Also, since the adhesive has a low high frequency loss and a low dielectric constant, it is possible to realize a flip chip package having a superior electrical performance. The conductive adhesive is particularly useful for the flip chip packaging of a device having a bandwidth of microwave and millimeter wave.

Method for manufacturing conductive adhesive for high frequency flip chip package applications

A method for forming flip chip bumps or UBM for a high speed copper interconnect chip, and more particularly to a method for forming a flip chip bump or UBM of copper/nickel, copper/nickel/copper or etc. which are carried out by a subsequent process of electroless copper plating and electroless nickel plating on a copper I/O pad. According to the method, both of electroless copper and nickel plating methods are used for forming electroless copper/nickel bumps of a copper interconnect chip so that advantages of the electroless copper plating, i.e. excellent selectivity and adhering strength to the copper chip pad and an advantage of the electroless nickel plating, i.e. excellent plating rate can be achieved at the same time.

Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method

Disclosed is a method of preparing anisotropic conductive adhesives for flip chip interconnection on organic substrates, in which an epoxy resin as a binder is mixed with a conductive material and a non-conductive material at room temperature for 3 hours and then, with a coupling agent and a curing agent at room temperature for 1 hour. The anisotropic conductive adhesives are endowed with the electrical conductivity of conventional anisotropic conductive films and the mechanical reliability of an underfill used in a solder flip chip, simultaneously. The ACA shows fast hardenability and excellent coating and screening properties. The adhesive is spread over a plastic printed circuit board into which a flip chip is then brought. The flip chip and the plastic substrate can be bonded to each other using heat and pressure. Also, it is applicable for low-price flip chips and chip size packaging as well as for relevant-assembly packaging.

Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate

A method for fabricating chip size packages which uses a lamination process, thereby not only achieving an improvement in the reliability of final electronic products, a reduction in the manufacturing costs, and a mass production resulting in a high marketability, but also being applicable to the fabrication of packages for both memory and non-memory chips and enabling the final electronic products to have high electronic performance while making the package size of the final electronic products not greater than 1.2 times the semiconductor chip size. The method includes the steps of cutting a wafer into a plurality of wafer strips each having several dies, arranging the wafer strips on an adhesive-coated polymer film supported by an annular frame in such a manner that they are aligned with each other while being uniformly spaced from one another, bonding the aligned wafer strips to the polymer film in accordance with a lamination process, forming a polymer dam made of an epoxy-based polymer on the polymer film around a wafer region, forming an encapsulant encapsulating the wafer strips, forming a double laminated polymer film to encapsulate the chips as an alternative encapsulation method, forming via holes at positions respectively corresponding to pads of chips through the polymer film, forming an array of I/O pads for the chips, fusing solder balls to the I/O pads, and cutting several ten dies integrally formed in one lot into separate packages.

Growing community of inventors

Daejeon, South Korea

Kyung Wook Paik