Seoul Viosys Co., Ltd.

Kyung Wan Kim

Yeo Jin Yoon

Shiro Sakai

Hwa Mok Kim

Joon Hee Lee

Ye Seul Kim

Chang Youn Kim

Jin Young Lee

Sang Hyun Oh

Tae Kyoon Kim

In Soo Kim

Sum Geun Lee

Jae Kwon Kim

Ji Hye Kim

Duk Il Suh

Soo Young Moon

A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.

Light emitting diode and method of fabricating the same

Provided are a substrate having concave-convex patterns, a light-emitting diode (LED) including the substrate, and a method of fabricating the LED. The LED includes a substrate, and concave-convex patterns disposed in an upper surface of the substrate and having convexes and concaves defined by the convexes. Unit light-emitting device having a first conductive semiconduct or layer, an active layer, and a second conductive semiconductor layer disposed on the substrate in sequence is present.

Substrate having concave-convex pattern, light-emitting diode including the substrate, and method for fabricating the diode

Provided are a light emitting diode (LED) and a method of fabricating the same. The LED includes a unit chip. The unit chip includes a substrate, and a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer which are sequentially stacked on the substrate. A concavo-convex structure having the shape of irregular vertical lines is disposed in a side surface of the unit chip.

Growing community of inventors

Ansan-si, South Korea

Kyung Wan Kim