Lg Innotek Co., Ltd.

Ls Cable Ltd.

Kyung-Tae Wi

Joon-Mo Seo

Byoung-Un Kang

Tae-Hyun Sung

Jae-Hoon Kim

Byoung-Kwang Lee

Dong-Cheon Shin

Soon-Young Hyun

Jai-Hoon Kim

Chan-Young Choi

A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Dicing die attachment film and method for packaging semiconductor using same

A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.

Dicing die adhesive film for semiconductor

Growing community of inventors

Ayang-si, South Korea

Kyung-Tae Wi