Saehan Industries Incorporation

Ami Cosmetic Co., Ltd.

Saehan Industries Incorporated

Saehan Micronics Incorporation

Kyung Rok Lee

Soon Sik Kim

Kyeong Ho Chang

Jeong Min Kweon

Sung Min Park

Jung No Lee

Byung Seok Han

Kyung Min Kim

Jeong Hwan Kim

Su Yeong Kim

Il Hong

Do Gyeong Lee

Nu Rim Lee

Ji Mi Kang

A cosmetic composition including anextract and aextract as active ingredients is provided.

Cosmetic composition comprising osmanthus asiaticus extract and clematis apiifolia extract

Disclosed are a fermented ginseng berryproduct and a cosmetic composition containing the same. The fermented ginseng berryproduct is useful for anti-oxidation, anti-inflammation, collagen synthesis facilitation, skin wrinkle care, whitening, moisturizing, skin barrier improvement and atopy alleviation.

[object Object]

An insulating tape for use in LOC (lead-on-chip) type semiconductor chip packages. With a tripartite structure in which two adhesive layers are provided to both surfaces of a base film, the insulating tape ranges, in coefficient of thermal expansion, from 16.0 to 23.5 ppm/&deg; C. and is very useful in improving the reliability of LOC semiconductor chip packages having lead frames.

Insulating adhesive tape for a semiconductor chip package having a copper lead frame

A method for preparing polyamic acid and polyimide of three-dimensional molecular structure such that these polymers are superior in adhesive strength and high-temperature stability while maintaining their inherent thermal resistance and mechanical properties, and thus can be effectively used as an adhesive material for high temperature adhesive tapes suitable for semiconductor assembly. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III:

Method for the preparation of polyamic acid and polyimide

A polymide useful as an adhesive for semiconductor assemblies having excellent thermal resistance and adhesive strength at high temperatures. The polyimide adhesive is based on the polyimide represented by the following formula II which can be prepared through the thermal or chemical imidization of the polyamic acid represented by the following formula I:

Polyimide for high temperature adhesive

A method for preparing polyamic acid and polyimide, which is suitable for use in adhesives or adhesive tapes for electronic parts. The polymers have such three-dimensional molecular structures that a significant improvement can be brought about in solvent solubility, thermal resistance, mechanical properties, and adhesive properties onto various substrates. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III. The polyamic acid is converted into polyimide through thermal or chemical imidization.

Method for the preparation of polyamic acid and polymide useful for adhesives

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Seoul, South Korea

Kyung Rok Lee