Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Enter Tech Co., Ltd.

Other

Korea University Research and Business Foundation

Lg Display Co., Ltd.

Mplus Co., Ltd.

Kyung Ho Lee

Yong Jin Kim

Han Bit Kim

Jun Kun Choi

Jung Chak Ahn

Eun Sub Shim

Hwa Young Oh

Seok Jun Park

Je Hyun Bang

Kwang Hyung Lee

Jung Wook Lim

Sung Ho Choi

Jung Hoon Park

Jung Bin Yun

Min Ji Jung

Seok Hwan Kim

Jae Woo Jun

Hirosige Goto

Sang Chul Sul

Ki Suk Woo

Jee Sung Lee

Young Woo Jung

Kyung Moon Jung

Suk Jin Ham

Jong Man Kim

Po Chul Kim

Young Nam Hwang

Sung Soo Choi

Seung Joo Nah

Yeong Min Jeong

Chul Kyu Kim

Kyung Bae Park

Kang Heon Hur

Sang Jong Lee

Sung Han Kim

Jin Ho Seo

Kyu Sik Kim

Yun Kyung Kim

Chang Hwan Choi

Tae Ho Yun

Hyuk Soon Choi

Tae Sub Jung

Jong Eun Park

Choon Keun Lee

Jong Rip Kim

Kyo Jin Choo

Sung Jun Lim

Jun Suk Lee

Hee Geun Jeong

Yi Tae Kim

Ju Hyeon Lee

Seung Wan Woo

Doo Sik Seol

Young In You

Se Min Oh

Jeong Yeol Moon

Kwang Hee Lee

Young Oh

Young Bok Yoon

Jong Hwa Lee

Myung Sam Kang

Dong Jin Kim

Young Chan Kim

Su Bong Jang

Seung Wook Lee

Chang Yeon Kim

Do Young Lee

Tae Hun Lee

Bum Sik Kim

Bang Won Oh

Jae Hee Lee

Kwang-hee Lee

Won Sun Park

Seung Heon Han

Masato Fujita

Seung Jae Song

Hye Jung Lee

Moo Sup Lim

Jung Park

Jeong Ho Yoon

Sae-Young Kim

Changsung Sean Kim

Seok Hwan Ahn

Hyun Sik Yoon

Mi Yang Kim

Jong Pa Hong

Se Yeon Hwang

Woong Sik Kim

Yong Jei Lee

Gyu Sik Kim

Jong Seuk Kang

Seon Ju Kim

Seung Ki Jung

Hee Suk Chung

Chui Kyu Kim

Dong Young Jang

Lee Young Kim

Hoe Woo Koo

Si Young Yang

In Hyun Cho

A camera module includes: a housing defining an internal space; a first lens module disposed in the internal space to move along an optical axis direction, the first lens module including at least one first bearing member; a second lens module disposed in the internal space to move along the optical axis direction, the second lens module including at least one second bearing member; a shaft disposed in the housing and supporting a first side of the first lens module and contacting the at least one first bearing member and supporting a first side of the second lens module and contacting the at least one second bearing member; at least one first ball member supporting a second side of the first lens module; and at least one second ball member supporting a second side of the second lens module.

Camera module

An image sensor includes a substrate including a first side on which light is incident, and a second side opposite to the first side, a pixel isolation pattern formed inside the substrate which defines a plurality of unit pixels, a first photoelectric conversion region and a second photoelectric conversion region arranged along a first direction, inside each of the unit pixels, and a region isolation pattern which protrudes from the pixel isolation pattern in a second direction intersecting the first direction, and defines an isolation region between the first photoelectric conversion region and the second photoelectric conversion region. A first width of the isolation region in the second direction on the first side is more than about 1.1 times a second width of the isolation region in the second direction on the second side.

Image sensor

An image sensor includes a substrate, a first isolation region defining a unit pixel, a first photoelectric conversion region in the unit pixel, a second photoelectric conversion region in the unit pixel, the second photoelectric conversion region spaced apart from the first photoelectric conversion region, a floating diffusion region, the floating diffusion region adjacent to the first surface of the substrate, a first transfer gate on the first surface of the substrate, the first transfer gate between the first photoelectric conversion region and the floating diffusion region, and a second transfer gate on the first surface of the substrate, the second transfer gate between the second photoelectric conversion region and the floating diffusion region. At least a part of the first transfer gate is buried in the substrate, and a bottom surface of the first transfer gate is different in height from a bottom surface of the second transfer gate.

Image sensor having different concentration of impurities in the channel regions and isolation elements

An image sensor is provided. The image sensor includes: a pixel array including a plurality of pixels arranged along rows and columns; and a row driver which drives the plurality of pixels for each of the rows, wherein each of the plurality of pixels includes a plurality of sub-pixels, each of the plurality of sub-pixels includes a plurality of photoelectric conversion elements sharing a floating diffusion area with each other, and a micro lens disposed to overlap the plurality of photoelectric conversion elements, a readout area is defined on the pixel array in accordance with a preset readout mode, and the row driver generates a drive signal for reading out signals provided from a photoelectric conversion element included in the readout area from among the plurality of photoelectric conversion elements, and provides the drive signal to the pixel array.

Image sensor with pixel structure including floating diffusion area shared by plurality of photoelectric conversion elements and a signal readout mode

Image sensors are provided. The image sensors may include a substrate including first, second, third and fourth regions, a first photoelectric conversion element in the first region, a second photoelectric conversion element in the second region, a third photoelectric conversion element in the third region, a fourth photoelectric conversion element in the fourth region, a first microlens at least partially overlapping both the first and second photoelectric conversion elements, and a second microlens at least partially overlapping both the third and fourth photoelectric conversion elements. The image sensors may also include a floating diffusion region and first, second and third pixel transistors configured to perform different functions from each other. Each of the first, second and third pixel transistors may be disposed in at least one of first, second, third and fourth pixel regions. The first pixel transistor may include multiple first pixel transistors.

Image sensors

An image sensor includes a pixel array including a plurality of pixels arranged in a first direction and a second direction. Each pixel of the plurality of pixels includes a plurality of photodiodes disposed adjacent to one another in at least one of the first direction and the second direction. The image sensor further includes a control logic configured to generate image data by obtaining pixel signals from the plurality of pixels, and read a pixel voltage corresponding to charges generated by two or more of the plurality of photodiodes included in one of the plurality of pixels, at substantially the same time.

Provided are a method of detecting abnormal financial transactions and an apparatus thereof. The apparatus includes: a memory in which an abnormal transaction detection program is stored; and a processor configured to execute the program. Upon execution of the program, the processor performs a data preprocessing operation to acquired payment data, extracts at least one feature adaptively determined in advance from results of the preprocessing operation, and uses the extracted feature to determine whether the payment data correspond to an abnormal transaction through a machine learning algorithm adaptively determined in advance.

Apparatus and method of detecting abnormal financial transaction

A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

Semiconductor package for reducing stress to redistribution via

A camera module is provided. The camera module includes a lens module having at least one lens; a housing, configured to accommodate the lens module; and a driving unit, disposed between the lens module and the housing, and including a magnet portion and a coil portion, wherein the coil portion is disposed to surround the magnet portion.

An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.

Optical assembly

Image sensor with pixel structure including floating diffusion area shared by plurality of photoelectric conversion elements

A folded module includes a housing having an internal space and including a protruding wall protruding in a direction perpendicular to an optical axis direction; a rotation holder including a reflective member, and supported by an internal wall of the housing with a rotation plate interposed therebetween to be disposed in the internal space; and a stopper coupled to the protruding wall of the housing, and limiting movement of the rotation holder in an optical axis direction, and the stopper includes a separation prevention structure.

Folded module and portable electronic device including the same

An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected through coil connecting portions and include coil patterns disposed on an outer side and coil patterns disposed on an inner side thereof, a coil pattern disposed on the inner side adjacent to the coil pattern disposed on the outer side includes two coil connecting portions spaced apart from each other and facing each other in a length direction of the body, and a dummy electrode pattern is further disposed in a void portion between two coil connecting portions.

Inductor

Growing community of inventors

Suwon-si, South Korea

Kyung Ho Lee