Samsung Electronics Co., Ltd.

Kyung-du Kim

Dong-chun Lee

Dong-Woo Shin

Seong-Chan Han

Hyo-Jae Bang

Yong-Hyun Kim

Chang-Yong Park

Sun-kyu Hwang

Hyun-Jong Oh

Kwang-Ho Chun

Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

Semiconductor package having passive component and semiconductor memory module including the same

A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

Heat spreader, semiconductor package module and memory module having the heat spreader

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Daejeon, South Korea

Kyung-du Kim