Samsung Electro-mechanics Co., Ltd.

Kyung-Ah Lee

Jee-Soo Mok

Jun-Heyoung Park

Eung-Suek Lee

Jun-Oh Hwang

A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

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Seoul, South Korea

Kyung-Ah Lee