Lg Electronics Inc.

Samsung Electronics Co., Ltd.

Postech Research and Business Development Foundation

Kyuhyun Bang

Byungjoon Rhee

Younghak Chang

Chisun Kim

Sukkoo Jung

Hyunggu Kim

Eun Joo Jang

Hyo Sook Jang

Yuho Won

Yong Wook Kim

Jihyun Min

Eunhye Kim

Jeongmin Kim

Hwanjoon Choi

Byungwoo Jeoung

Sungjee Kim

Yongdae Kang

Yong Ju Kwon

Anastasia Agnes

Eunjae Lee

The invention relates to InP-based nanoclusters that include indium and phosphorus and further include zinc, chlorine, or a combination thereof, and to a method of preparing the InP-based nanoparticles including heating the InP-based nanoclusters in the presence of zinc, chlorine, or a combination thereof.

InP-based nanocluster, and method of preparing InP-based nanoparticle

A display device including a substrate including a wiring electrode; a plurality of semiconductor light emitting devices electrically connected to the wiring electrode; and an intermediate electrode extending along one direction to be electrically connected to conductive electrodes of adjoining semiconductor light emitting devices, covering the conductive electrodes, and facing the wiring electrode to be electrically connected to the wiring electrode.

Display device using semiconductor light emitting device and method for manufacturing the same

A display device including a plurality of semiconductor light emitting devices on a wiring substrate; a connection part on the wiring substrate and configured to electrically-connect the plurality of semiconductor light emitting devices to the wiring substrate. Further, each of the plurality of semiconductor light emitting devices includes a first conductive semiconductor layer; a second conductive semiconductor layer overlapped with the first conductive semiconductor layer; a first conductive electrode on the first conductive semiconductor layer; and a second conductive electrode on the second conductive semiconductor layer. In addition, the connection part includes a first conductive layer formed of a same material as the first conductive electrode and a second conductive layer formed of a same material as the second conductive electrode.

Display device using semiconductor light emitting devices and method for manufacturing the same

A display device including a wiring substrate having a first substrate layer and a second substrate layer, a conductive adhesive layer configured to cover the wiring substrate, a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer and electrically connected to a first electrode and a second electrode. Further, the first electrode is disposed on the first substrate layer, and the second substrate layer has one surface facing the conductive adhesive layer and the other surface covering the first electrode, and an auxiliary electrode electrically connected to the first electrode and the second electrode are disposed on one surface of the second substrate layer.

Display device using semiconductor light emitting device

Discussed is a display device including a substrate having at least one of a first and a second electrode, a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first and second electrode, wherein the conductive adhesive layer has a first conductive adhesive layer disposed in a first region and a second conductive adhesive layer disposed in a second region adjoining to the first region such that the conductive adhesive layer is partitioned into a plurality of regions on the wiring substrate.

Disclosed are a non-polar nitride-based light emitting device and a method for fabricating the same. The non-polar nitride-based light emitting device includes a substrate, a first-type semiconductor layer on the substrate, an active layer on the active layer, a second-type semiconductor layer on the active layer, a light extraction layer on the second-type semiconductor layer and including at least one layer including indium having a plurality of unit structures having an inverted pyramidal intaglio shape, a first electrode electrically connected to the first-type semiconductor layer, and a second electrode electrically connected to the second-type semiconductor layer.

Non-polar nitride-based light emitting device and method for fabricating the same

Disclosed are a non-polar hetero substrate, a method for manufacturing the same, and a nitride-based light emitting device using the same. The non-polar hetero substrate includes a non-polar base substrate, a nitride base layer disposed on the substrate, a defect reduction layer disposed on the nitride base layer, the defect reduction layer including a plurality of air gaps, and a nitride semiconductor layer disposed on the defect reduction layer.

Non-polar substrate having hetero-structure and method for manufacturing the same, and nitride-based light emitting device using the same

Discussed is a display device including a wiring substrate disposed with a first electrode; a conductive adhesive layer disposed between the wiring substrate and a second electrode; and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first electrode and the second electrode, wherein at least one of the plurality of semiconductor light emitting devices comprises a first conductive electrode and a second conductive electrode disposed to be separated from each other, the at least one of the semiconductor light emitting devices having a lateral surface, and wherein the second conductive electrode extends beyond the lateral surface of the at least one of semiconductor light emitting devices.

Display device using semiconductor light emitting device and method of fabricating the same

Discussed is a display device including a wiring substrate having a first substrate layer and a second substrate layer, a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to a first electrode and a second electrode, wherein the first electrode is disposed at the first substrate layer, and the second substrate layer includes one surface facing the conductive adhesive layer and the other surface covering the first electrode, and an auxiliary electrode electrically connected to the first electrode and the second electrode are disposed on one surface of the second substrate layer.

Growing community of inventors

Seoul, South Korea

Kyuhyun Bang