Samsung Electronics Co., Ltd.

Kyu-Sub Kwak

Young-Min Lee

Youn-ho Choi

Jae-Hyuck Lee

Se-Ho Park

Ho-seong Seo

Shi-yun Cho

Yu-Su Kim

Jae-Eun Kang

Ji-hyun Jung

Shi-Yun Cho

Seung-Woo Han

Sang-Hyun Kim

Chi-Yul Yoon

Jae-Woo Ko

Ji-Woon Yeom

A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.

Large capacity memory module mounting device for portable terminal

A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.

Multi-layer printed circuit board having built-in integrated circuit package

A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.

Printed circuit board, method of fabricating the same, and electronic apparatus employing the same

A semiconductor die package includes a substrate, a semiconductor die mounted on the substrates a molding covering the semiconductor die and which is formed on the substrate and a conductive layer laminated on the molding.

Semiconductor die package and integrated circuit package and fabricating method thereof

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Suwon-si, South Korea

Kyu-Sub Kwak