Samsung Electro-mechanics Co., Ltd.

Kyu Sik Park

Myung Jun Park

Young Sook Lee

Woo Kyung Sung

Jun Hyeong Kim

Kwang Yeun Won

Jae Yeol Choi

Doo Young Kim

Eun Jin Kim

Yoo Jeong Lee

Eui Hyun Jo

Jin Soo Park

Hyung Jong Choi

So Jung An

Kang Ha Lee

Yeon Song Kang

Ha Jeong Kim

Eun Me Park

Jin Yeop Yoo

Jong Ryeong Kim

Kong Joo Jeon

Kwan Young Son

A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.

Multilayer electronic component

A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers respectively interposed therebetween, the first internal electrodes being exposed to two end surfaces of the body, the second internal electrodes being exposed to a mounting surface of the body perpendicular to the end surfaces; a pair of connection portions each including a conductive layer disposed on one of the end surfaces of the body and connected to the first internal electrodes and an insulating layer disposed on the conductive layer; first and second external electrodes disposed on the mounting surface of the body and connected to the conductive layers of the pair of connection portions, respectively; and a third external electrode disposed between the first and second external electrodes on the mounting surface of the body and connected to the second internal electrodes.

Multilayer electronic component having improved electrode structure for increased capacity per unit volume

An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.

Electronic component having a body and sealing thin film disposed in a microhole of the body

A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.

Multilayered electronic component and method of manufacturing the same

There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having the dielectric layer interposed therebetween, electrode layers formed on the first and second end surfaces of the ceramic body and electrically connected to the plurality of internal electrodes, and an impact absorption layer formed on the electrode layer so that an edge thereof is exposed.

Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereon

There is provided a multilayered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second side surfaces; first and second internal electrodes having an overlapping region provided in the ceramic body, forming a capacitance forming area exposed to the first side surface, the first internal electrode having a first lead-out portion, and the second internal electrode being insulated from the first internal electrode and having a second lead-out portion; a first external electrode connected to the first lead-out portion and a second external electrode connected to the second lead-out portion; and an insulating layer formed on the first side surface, wherein the first and second external electrodes further include non-conductive layers formed on outer surfaces thereof.

Multilayered ceramic electronic component and board for mounting the same

Growing community of inventors

Gyunggi-do, South Korea

Kyu Sik Park