Ntrium Inc.

Kyu Jae Lee

Seungjae Lee

Se Young Jung

Ki Su Joo

Se Young Jeong

Jung Woo Hwang

Kisu Joo

Yoon Hyun Kim

A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.

Semiconductor package and method for manufacturing the same

Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.

Electronic device having electromagnetic interference shielding layer and method of manufacturing the same

Growing community of inventors

Gyeonggi-do, South Korea

Kyu Jae Lee