Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Kyu-ho Shin

Su-ho Shin

Chang-youl Moon

Soon-cheol Kweon

Ki-hwan Kwon

Seung-tae Choi

Jin-seung Choi

Sung-hee Lee

Eung-Yeoul Yoon

Arthur Darbinian

Hyun-Soo Kim

Young-min Cheong

Jae-ho Moon

Seong-taek Lim

Seung-Tae Choi

Jae-hee Cho

Yong-jun Kim

Kae-dong Back

Ji-hyuk Lim

Chang-roul Moon

Sang-young So

Jae-youl Jeong

Sang-Young So

Jae-Youl Jeong

An electric dust collecting device is provided. The electric dust collecting device according to an embodiment includes a mixing part into which outside air flows, an electrostatic sprayer configured to spray droplets charged to the mixing part to be combined with contaminants contained in outside air, a dust collecting part configured to form an electric field and adsorb droplets combined with contaminants, and a draining part combined with the dust collection part to discharge the droplets adsorbed in the dust collecting part.

Electric dust collecting device and humidifying air conditioner including the same

An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

LED package structure and manufacturing method, and LED array module

A method of fabricating an image drum includes preparing a hollow drum body having a slot extending in a longitudinal direction, preparing a printed circuit board (PCB) having a plurality of board terminals, mounting the PCB inside the hollow drum body with a fixing member such that the board terminals of the PCB are placed in the slot of the hollow drum body, coating a first insulating layer on an outer circumference of the hollow drum body, forming a plurality of ring electrodes on the first insulating layer corresponding to the board terminals of the PCB, in which a portion of ring electrodes which corresponds to the board terminals of the PCB is non-continuous, exposing the board terminals below non-continuous area of the ring electrodes by etching the first insulating layer with the ring electrodes as an etching mask, and forming a connecting electrode to electrically connect the board terminals to the ring electrodes.

Image drum and fabricating method thereof

An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

LED package and fabrication method thereof

A flexible device and a flexible pressure sensor. The present flexible device includes: a first flexible substrate formed of a flexible material to have a flexibility; an active element formed to have a predetermined thickness and a flexibility, and being attached on the first flexible substrate; and a second flexible substrate formed of a flexible material to have a flexibility, and being deposited on the active element. The flexible device and the flexible pressure sensor have a high flexibility, so that they may be applied for a medical treatment such as implantation to a living body, a human body and so forth. In addition, the flexible device has a high flexibility, so that it may be inserted to a curved surface, which contributes to remove the limit of space where the semiconductor package device may be inserted.

Flexible device, flexible pressure sensor

A method of manufacturing an image drum includes fixing a control circuit board inside the drum body so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts.

Method of manufacturing an image drum

A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

LED array module

Provided is a vertical semiconductor light-emitting device and a method of manufacturing the same. The method may include sequentially forming a lower clad layer, an active layer, and an upper clad layer on a substrate to form a semiconductor layer and forming first electrode layers on the upper clad layer. A metal support layer may be formed on each of the first electrode layers and a trench may be formed between the first electrode layers. The substrate may be removed and a second electrode layer may be formed on the lower clad layer.

Vertical semiconductor light-emitting device and method of manufacturing the same

Provided are a toner supply roller and an image forming apparatus using the toner supply roller. The image forming apparatus employs a direct image developing technique, and includes the toner supply roller having a plurality of electrodes formed on an outer surface thereof to selectively supply toner to an image forming unit.

Toner supply roller and image forming apparatus using the same

A method of fabricating a backlight module in which at least one luminescence element is positioned, including: positioning a luminescence element in at least one cavity formed on a carrier; forming a lower electrode on a substrate; transferring the luminescence element positioned on the carrier to the substrate, connecting the luminescence element to a pattern of the lower electrode formed on the substrate, and removing the carrier; forming an insulating layer on a surface of the substrate to which the luminescence element is transferred, and exposing a top region of the luminescence element; and forming an upper electrode on the exposed top region of the luminescence element. Accordingly, the backlight module including very small luminescence elements being of a micro unit in size is easily fabricated.

Backlight module including at least one luminescence element, and method of fabricating the same

A lighting device is provided. The lighting device includes a light source, a light source supporting member which has a surface to which the light source is attached, and a heat sink on an opposite surface of the light source supporting member, for dissipating heat generated by the light source. In addition, the heat sink includes a heat transfer member which protrudes from the surface of the light source supporting member; a plurality of first fins which are spaced apart from each other at intervals in a length direction of the heat transfer member, and are arranged parallel to the light source supporting member; and a plurality of second fins which are spaced apart from each other at intervals, surround outer portions of the first fins, and are arranged perpendicularly to the light source supporting member.

Lighting device

An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and second conductor unit. The LED is bonded to the first conductor unit. The cap is mounted on the substrate over the LED and comprises a conductive wire which connects the LED to the second conductor unit.

LED package, manufacturing method thereof, and LED array module using the same

An ink jet printer head includes a substrate having a heat resisting body, an ink chamber barrier installed on the substrate so as to form a side wall of an ink chamber filled with ink introduced through an ink channel, and a nozzle plate having a nozzle hole communicating with the ink chamber and installed on the ink chamber barrier, and an ink separating wall protruding from a periphery of the nozzle hole towards the substrate located on the ink channel to interrupt a flow of the ink is provided in the nozzle plate. The backflow of the ink into the interior of the ink channel and an ink tail generated in the nozzle and a satellite droplet are reduced by using the ink separating wall, thereby improving printing efficiency and printing quality.

Growing community of inventors

Seoul, South Korea

Kyu-ho Shin