Cheil Industries Inc.

Kyu Bong Kim

Woo Jun Lim

Young Ju Shin

Kyoung Hun Shin

Hyun Joo Seo

Do Hyun Park

A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a polyurethane resin; at least one other resin selected from the group of an ethylene-vinyl acetate copolymer resin, an acrylonitrile resin, and a styrene resin; isobornyl acrylate; and conductive particles.

Semiconductor device connected by anisotropic conductive film

A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.

Semiconductor device connected by anisotropic conductive adhesive film

A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40&#xb0; C. after curing of the film, and a peak point of 80&#xb0; C. to 90&#xb0; C. in a DSC (Differential Scanning calorimeter) profile of the film.

A semiconductor device including a first connecting member including a first electrode; a second connecting member including a second electrode; and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film bonding the first electrode to the second electrode, wherein the anisotropic conductive film exhibits linear indentations in an inter-terminal space of the second connecting member after pre-compression and primary compression of the anisotropic conductive film onto the first and second connecting members.

Growing community of inventors

Uiwang-si, South Korea

Kyu Bong Kim