Nitto-denko Corporation

Kyouyuu Jo

Yasufumi Miyake

Hirofumi Fujii

Masaki Mizutani

Katsutoshi Hirashima

A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises: (A) a cyclic phosphazene compound represented by the following general formula (1): wherein at least one of the Rs is an organic group having the urethane(meth)acrylate structure represented by the following general formula (2) and n is a positive number of 2 to 5: wherein Ris a hydrogen atom or a methyl group;(B) a carboxyl-containing linear polymer obtained by polymerizing an ethylenically unsaturated compound through addition polymerization;(C) an epoxy resin;(D) an ethylenically unsaturated group-containing polymerizable compound; and(E) a photopolymerization initiator;wherein the cyclic phosphazene compound (A) is present in a proportion of 5 to 30 wt % based on the total weight of the composition.

Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin composition

The invention provides a process for producing a substrate for flexible circuit boards which comprises: providing a multilayered insulating resin layer comprising an insulating layer and an adhesive layer; and laminating a metal foil to the insulating layer of the multilayered insulating resin layer via the adhesive layer at a temperature not lower than the glass transition temperature of the insulating layer.

Growing community of inventors

Ibaraki, Japan

Kyouyuu Jo