Samsung Electronics Co., Ltd.

Kyoungwon Na

Hyunchul Kim

In Sung Joe

Minho Jang

Seungkuk Kang

Hyun Young Yeo

An image sensor includes a first chip that includes a pixel region and a pad region, and a second chip that is in contact with one surface of the first chip and includes circuits that drive the first chip. The first chip includes a first substrate, an interlayer insulating layer disposed between the first substrate and the second chip, first interconnection lines disposed in the interlayer insulating layer, a conductive pad disposed in the pad region between the second chip and the first interconnection lines, and a recess region formed in the pad region that penetrates the first substrate and the interlayer insulating layer and exposes the conductive pad.

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SEOUL, South Korea

Kyoungwon Na