Samsung Electronics Co., Ltd.

Seoul National University

Kyoungwhan Oh

Sunghwan Kim

Ho Young Kim

Juhyung Lee

Jaehong Lee

Minwoo Rhee

Ansook Sul

Sunwoo Park

Jungwoo Cho

Jaekyung Park

Takashi Sasa

Hyunjin Lee

Jubong Lee

Yohan Choe

Seungdon Lee

Sujie Kang

Jungshin Lee

An apparatus for cleaning a bowl includes a base plate, and a blade coupled to the base plate. The blade extends in a curve on a surface of the base plate in a direction receding from a center of the base plate in a plan view. An inner side surface of the blade includes a curved surface concavely recessed toward an inside of the blade in a cross-sectional view taken along a direction perpendicular to an extending direction of the blade.

Apparatus for cleaning a bowl and a photoresist (PR) coating system including the same

A chemical liquid supply system includes a chemical liquid tank including an inlet allowing a chemical fluid to be introduced therethrough, an opening allowing the chemical liquid introduced through the inlet to be temporarily stored, and an outlet allowing the chemical liquid stored in the opening to flow out therethrough, a chemical liquid circulation apparatus including a supply flow path supplying the chemical liquid to the inlet and a recovery flow path resupplying the chemical liquid collected from the outlet to the supply flow path, a chemical liquid supply source supplying the chemical liquid to the supply flow path of the chemical liquid circulation apparatus, and a chemical liquid dispensing apparatus configured to move to the opening and draw the chemical liquid from the opening, move to a substrate to be treated and discharge the chemical liquid onto the substrate.

Chemical liquid circulation apparatus, chemical liquid dispensing apparatus, and chemical liquid supply system having the same

A substrate processing apparatus includes a substrate stage configured to support a semiconductor substrate, the substrate stage being rotatable at a predetermined angular velocity, and a discharge device above the substrate stage, the discharge device being configured to discharge a chemical solution onto the semiconductor substrate, and the discharge device including a nozzle arm movable along a radial direction from a central region of the substrate stage to a peripheral region surrounding the central region, a nozzle on the nozzle arm, the nozzle facing the substrate stage, and the nozzle being configured to discharge the chemical solution onto the semiconductor substrate at a predetermined angle relative to a surface of the semiconductor substrate, and an angle changer configured to change the predetermined angle such that the predetermined angle gradually decreases as the nozzle arm moves from the central region to the peripheral region.

Substrate processing apparatus and method of manufacturing semiconductor device using the same

A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.

3D printing apparatus and 3D printing method

Growing community of inventors

Hwaseong-si, South Korea

Kyoungwhan Oh