Samsung Electronics Co., Ltd.

Kyoungsei Choi

Jongbo Shim

Un-Byoung Kang

Heeseok Lee

Yungcheol Kong

Jongkook Kim

Jihwang Kim

Hyunkyu Kim

Jungwoo Kim

Jangwoo Lee

Ji Hwang Kim

Choongbin Yim

Hyunsu Jun

Eunhee Jung

Yoonha Jung

Bona Baek

Donghan Kim

Yechung Chung

Tongsuk Kim

Chulwoo Kim

Ji-yong Park

Jae Choon Kim

Hyunki Kim

Doohwan Lee

Eunseok Song

Eunseok Cho

Woonbae Kim

SeokWon Lee

Mi-Na Choi

Jungsoo Byun

Sayoon Kang

Daewoo Son

Junggon Choi

JiSun Hong

Heejung Hwang

YoungSang Cho

Seran Bae

Sungeun Pyo

Hwanggil Shim

Jeongmin Kang

A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.

Semiconductor package including an interposer and method of fabricating the same

A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a molding layer covering side walls of the first semiconductor chip and including through holes, an interposer on the first semiconductor chip and the molding layer, conductive connectors in the through holes of the molding layer and connected to the first package substrate and the interposer, and an insulating filler including a first portion that fills the through holes of the molding layer so as to surround side walls of the conductive connectors.

Methods of manufacturing semiconductor packages

A semiconductor package includes: a redistribution layer including a plurality of redistribution insulating layers, a plurality of redistribution line patterns that constitute lower wiring layers, and a plurality of redistribution vias that are connected to some of the plurality of redistribution line patterns while penetrating at least one of the plurality of redistribution insulating layers; at least one semiconductor chip arranged on the redistribution layer; an expanded layer surrounding the at least one semiconductor chip on the redistribution layer; and a cover wiring layer including at least one base insulating layer, a plurality of wiring patterns that constitute upper wiring layers, and a plurality of conductive vias that are connected to some of the plurality of wiring patterns while penetrating the at least one base insulating layer.

Semiconductor package, and package on package having the same

A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.

Semiconductor package and method of fabricating the same

A semiconductor package is provided including a package substrate. The package substrate includes a substrate pattern and a substrate insulation layer at least partially surrounding the substrate pattern. The package substrate has a groove. An external connection terminal is disposed below the package substrate. An embedded semiconductor device is disposed within the groove of the package substrate. The embedded semiconductor device includes a first substrate. A first active layer is disposed on the first substrate. A first chip pad is disposed on the first active layer. A buried insulation layer is disposed within the groove of the package substrate and at least partially surrounds at least a portion of a lateral surface of the embedded semiconductor device. A mounted semiconductor device is disposed on the package substrate and is connected to the package substrate and the embedded semiconductor device.

Semiconductor package including an embedded semiconductor device

Semiconductor package including an in interposer and method of fabricating the same

Semiconductor package with interposer

Method of fabricating semiconductor package

A semiconductor package includes a first plate having a through hole therein, at least one interconnection layer disposed on a first surface of the first plate, and at least one semiconductor chip disposed on the at least one interconnection layer in a space defined by the through hole and electrically connected to the least one interconnection layer. The package further includes a second plate disposed on the at least one semiconductor chip and a second surface of the first plate on a side of the first plate opposite the first surface, and at least one conductive pad disposed on the second surface of the first plate and electrically connected to the at least one interconnection layer.

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Provided are a stacked image sensor package and a packaging method thereof. A stacked image sensor package includes: a stacked image sensor in which a pixel array die and a logic die are stacked; a redistribution layer formed on one surface of the stacked image sensor, rerouting an input/output of the stacked image sensor, and including a first pad and a second pad; a memory die connected with the first pad of the redistribution layer and positioned on the stacked image sensor; and external connectors connected with the second pad, connecting the memory die and the stacked image sensor with an external device, and having the memory die positioned therebetween.

Stacked image sensor package and stacked image sensor module including the same

Semiconductor packages are provided. The semiconductor packages may include a base film having a top surface and a bottom surface, a circuit pattern disposed on the top surface of the base film and connected to a ground terminal, a via hole penetrating the base film, a lower shielding layer that is electrically connected to the circuit pattern and fills the whole region of the via hole and cover the bottom surface of the base.

Semiconductor packages

Growing community of inventors

Yongin-si, South Korea

Kyoungsei Choi