Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Seagate Technology Incorporated

Seagate Technology International

Samsung Display Devices Co., Ltd.

Kyoung-won Na

Yoon-Dong Park

Sung-Dong Suh

Kook-hyun Sunwoo

Dong-Mo Im

Sang-on Choi

Jin-Seung Sohn

Myung-Sam Kang

Joo-ho Lee

Kwang-Min Lee

Sang-Chul Sul

Dong-mo Im

Keon-Yang Park

Won-Youl Choi

Seok-jin Kwon

Jeong-Hwan Lee

Jung-wook Lim

Pil-Kyu Kang

Yong-soo Oh

Chang-seung Lee

Yong-Su Kim

Kyoung-ho Ha

Deok-kee Kim

Dong-jae Shin

Myung-bok Lee

Sang-wook Lee

Seong-gu Kim

In-sung Joe

Ho-Chul Ji

Hyun-cheol Kim

Beom-suk Lee

Jin-kwon Bok

Jingli Yuan

Ki-Nam Kim

Sang-Hun Lee

Jung-Chak Ahn

June-mo Koo

Ju-Hwan Jung

Tae-Yon Lee

Hae-seok Park

Dong-seok Suh

Hae-sung Kim

Eun-sik Kim

Dae-lok Bae

Bum-seok Seo

Du-hyun Lee

Yong-woo Hyung

Seok-yong Hong

Dong-Seok Suh

Sung Dong Suh

Hyung Woo Choi

Myung-won Lee

Joo-yeong Gong

Ju-chul Park

Jae-chul Shim

In Kyeong Yoo

Kwnag-Soo Seol

Image sensors are provided. An image sensor includes a color filter layer. The image sensor includes a metal structure adjacent a sidewall of the color filter layer. The image sensor includes an insulating layer on the color filter layer. Moreover, the image sensor includes an electrode layer on the insulating layer. Methods of forming image sensors are also provided.

Image sensors and methods of forming image sensors

An image sensor includes a substrate comprising a first face and a second surface which faces the first surface and on which light is incident, a semiconductor photoelectric conversion device on the substrate, a gate electrode located between the first surface of the substrate and the semiconductor photoelectric conversion device and extending in a first direction perpendicular to the first surface, and an organic photoelectric conversion device stacked on the second surface of the substrate.

Image sensor including photoelectric conversion devices

An optical coupling system is provided which includes a first layer structure and a second layer structure. The first layer structure includes a plurality of layers sequentially stacked on a substrate, and is configured to compresses a beam emitted from a light source along a direction substantially perpendicular to a top surface of the substrate. The second layer structure is formed on the substrate, and is configured to compresses the beam, having passed through the first layer structure, along a direction substantially parallel to the top surface of the substrate.

Optical coupling system and optical sensor including the same

An optical biosensor may include a biosensing unit, detection unit, and signal processing unit. The biosensing unit may be configured for receiving first and second optical signals (which are generated from a phase-modulated optical signal), outputting a sensing signal by transmitting the first optical signal via a first optical path that includes a sensing resonator, and outputting a reference signal by transmitting the second optical signal via a second optical path that includes a reference resonator. The detection unit may be configured for receiving the sensing signal and the reference signal, detecting a phase element of each of the sensing signal and the reference signal through a signal demodulation operation, and detecting a phase difference between the sensing signal and the reference signal according to the detected phase elements. The signal processing unit may be configured for calculating the concentration of a bio-material based on the detected phase difference.

Optical biosensor and method of operating the same

A sequencing apparatus may include a bio-disk having reaction regions in which nucleic acids are polymerized; a stage configured to revolve around an axis, the stage including optical heads for detecting lights emitted from the plurality of reaction regions due to the polymerization of the nucleic acids; and/or a control unit configured to generate data regarding base sequences of the nucleic acids in the reaction regions based on wavelengths of the lights detected by the plurality of optical heads. An optical head may include a light emitting unit configured to emit light toward a reaction region in which nucleic acids are polymerized; a light receiving unit configured to receive the light emitted by the light emitting unit; a de-multiplexing unit configured to de-multiplex the light received by the light receiving unit; and/or a plurality of photoelectric converting units configured to convert the de-multiplexed light to electrical signals.

Optical heads and sequencing apparatuses including the same

An optical biosensor including a bio-sensing unit configured to receive an optical signal and generating a sensed optical signal, the wavelength of which varies according to a result of sensing a biomaterial; and a spectrometer including a plurality of ring resonators for dividing the sensed optical signal according to a wavelength and generating a plurality of output optical signals, respectively.

Optical biosensor, bio-sensing system including the same, and method of fabricating the optical biosensor

An optical modulator comprises a bulk-silicon substrate comprising a trench having a predetermined width and a predetermined depth. A bottom cladding layer is formed in the trench, and a plurality of waveguides and a phase modulation unit are formed on the bottom cladding layer. A top cladding layer is formed on the plurality of waveguides and the phase modulation unit.

Optical modulator formed on bulk-silicon substrate

Optical waveguide and coupler devices and methods include a trench formed in a bulk semiconductor substrate, for example, a bulk silicon substrate. A bottom cladding layer is formed in the trench, and a core region is formed on the bottom cladding layer. A reflective element, such as a distributed Bragg reflector can be formed under the coupler device and/or the waveguide device. Because the optical devices are integrated in a bulk substrate, they can be readily integrated with other devices on a chip or die in accordance with silicon photonics technology. Specifically, for example, the optical devices can be integrated in a DRAM memory circuit chip die.

Optical waveguide and coupler apparatus and method of manufacturing the same

Provided is a recording medium suitable for use in magnetic transfer of a servo pattern onto a magnetic recording medium. The recording medium includes a substrate including a plurality of servo regions and a plurality of data regions, and a magnetic layer formed on each of the servo regions and patterned in the shape of a servo pattern to be patterned on a magnetic recording medium, wherein the servo regions protrude relative to the data regions.

Recording device

A resistive memory device includes a vertical transistor and a variable resistance layer. The vertical transistor includes a gate electrode on a surface of a substrate, a gate insulation layer extending along a sidewall of the gate electrode, and a single crystalline silicon layer on the surface of the substrate adjacent to the gate insulation layer. At least a portion of the single crystalline silicon layer defines a channel region that extends in a direction substantially perpendicular to the surface of the substrate. The variable resistance layer is provided on the single crystalline silicon layer. The variable resistance layer is electrically insulated from the gate electrode. Related devices and fabrication methods are also discussed.

Resistive memory devices including vertical transistor arrays and related fabrication methods

Provided is a non-volatile memory device including at least one horizontal electrode, at least one vertical electrode, at least one data storage layer and at least one reaction prevention layer. The least one vertical electrode crosses the at least one horizontal electrode. The at least one data storage layer is located in regions in which the at least one vertical electrode crosses the at least one horizontal electrode, and stores data by varying its electrical resistance. The at least one reaction prevention layer is located in the regions in which the at least one vertical electrode crosses the at least one horizontal electrode.

Non-volatile memory device with data storage layer

Provided are a perpendicular magnetic recording head and a method of manufacturing the same. The perpendicular magnetic recording head includes a main pole including a pole tip applying a recording magnetic field to a recording medium, a coil surrounding the main pole in a solenoid shape such that recording magnetic field for recording information to a recording medium is generated at the pole tip, and a return yoke forming a magnetic path for the recording magnetic field together with the main pole and surrounding a portion of the coil passing above the main pole. The number of times that the coil passes above the main pole is smaller than the number of times that the coil passes below the main pole.

Perpendicular magnetic recording head and method of manufacturing the same

A magnetic write head includes a main pole, a return yoke forming a magnetic path with the main pole, a side shield formed at both sides of the main pole, and a shield gap layer formed between the side shield and the return yoke. The side shield and the return yoke have portions connected to each, and are separated from each other by the shield gap layer in an area except for the portions which contact. A first gap layer formed of a nonmagnetic insulation material is formed between both sides of the main pole and the side shield. A gap is formed between an end portion of the main pole and an end portion of the return yoke and a second gap layer is formed in the gap with a nonmagnetic insulation material.

Magnetic write head with side shield and gap layer

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Seoul, South Korea

Kyoung-won Na