Samsung Electronics Co., Ltd.

Kyoung-Soo Kim

Jin-Ho Park

Sun-Won Kang

Seung-Duk Baek

Ho-Geon Song

Gun-Ho Chang

Seung-chul Park

A semiconductor chip includes a semiconductor substrate, a through electrode, an inter-mediation pad, an upper pad, and a rewiring line. The semiconductor substrate includes a first surface that is an active surface and a second surface that is opposite to the first surface. The through electrode penetrates the semiconductor substrate and is disposed in at least one column in a first direction in a center portion of the semiconductor substrate. The inter-mediation pad is disposed in at least one column in the first direction in an edge portion of the second surface. The upper pad is disposed on the second surface and connected to the through electrode. The rewiring line is disposed on the second surface and connects the inter-mediation pad to the upper pad.

Semiconductor chip and semiconductor package including the same

A printed circuit board on which a connector is mounted includes a conductive layer, insulating layers, and a supporting member. A part of the conductive layer is exposed on a top surface of the PCB in order to form a connecting pad portion for connecting the connector. The insulating layers are disposed proximate to both sides of the conductive layer. The supporting member is connected to the conductive layer and covers a surface of a hole formed by opening an orifice through the conductive layer and the insulating layer. The hole is disposed adjacent to the connecting pad portion.

Printed circuit board and display device using the same

A method of calibrating a parameter to measure the back electromotive force (BEMF) of a voice coil motor (VCM), and a method and apparatus to use the calibrating method to perform unloading control. The calibration method includes: reading servo data and measuring a BEMF value while seeking two predetermined points on a disk, and storing the servo data and the BEMF value, generating an actual velocity curve of a head using the stored servo data, and an estimated velocity curve of the head using the stored BEMF value and adjusting a parameter related to a BEMF measurement to align the actual velocity curve of the head with the estimated velocity curve of the head.

Back electromotive force (BEMF) calibration method, method of controlling unloading of disk drive apparatus using BEMF calibration method, and disk drive apparatus using the same

Printed circuit board

Growing community of inventors

Suwon-si, South Korea

Kyoung-Soo Kim